Fab Module Engineer

Intel Corporation; Oregon; Sur place; USD 76 000 - 146 000; Plein temps

Avantages offerts par ce poste

Stock bonuses

Health benefits

Retirement plan

Vacation

Résumé du poste

Intel Corporation's Wafer Packaging Manufacturing (WPM) C4 OR group in Hillsboro, OR is seeking a Module Engineer to own high‑volume manufacturing equipment and processes, perform tests and optimizations, and drive safety, quality, and productivity improvements on the production line.

You will lead excursions, tool qualification during ramps, participate in technology transfer, and collaborate with suppliers and global teams to ensure consistent, world-class silicon manufacturing.

Qualifications

• Bachelor's degree in Engineering STEM field with 6+ months of experience in equipment maintenance and/or repair in manufacturing.
• Master's degree in engineering STEM field preferred.
• Requires ability to work on-site in a high-volume manufacturing environment.

Responsabilités

• Own and maintain high-volume manufacturing equipment and processes for precision, safety and efficiency.
• Conduct tests and analyses to monitor critical dimensions and defectivity on the production line.
• Lead improvements to manufacturing techniques, production efficiency and output.
• Enhance safety, quality, cost indicators and productivity across equipment and processes.
• Drive continuous improvement of equipment and process KPIs, collaborating with suppliers.
• Manage installation, conversion and qualification of tools during ramps; ensure safe, timely execution.
• Develop and optimize excursion prevention systems to safeguard equipment and processes.
• Detect and address discrepant material or activities to maintain process integrity.
• Participate in technology transfer, including training and auditing installations at other sites.

Connaissances

Problem solving

Communication

Formation

Bachelor's degree in Engineering

Master's degree in engineering

Description du poste

As a Module Engineer, you will play a pivotal role in the high-volume manufacturing of cutting-edge integrated circuits. You will own critical equipment and processes, conducting tests and optimizations to ensure precision, safety, and production efficiency. Your day-to-day responsibilities will directly contribute to delivering high-quality products that drive Intel's leadership in semiconductor innovation.

Business Group

You will be part of Intel Corporation's Wafer Packaging Manufacturing (WPM) C4 OR group, which focuses on advancing manufacturing technologies to enable rapid device miniaturization and mass production of integrated circuits. The team collaborates globally to optimize processes, enhance equipment performance, and support Intel's broader vision of delivering world-class silicon solutions.

Key Responsibilities

• Own and maintain high-volume manufacturing equipment and processes to ensure optimal performance, precision, and safety.
• Conduct tests, measurements, and analyses to monitor critical dimensions and defectivity within the production line.
• Recommend and implement modifications to improve manufacturing techniques, production efficiencies, and overall output.
• Lead efforts to enhance safety, quality, cost indicators, and productivity across equipment and processes.
• Drive continuous improvement initiatives for equipment and process key performance indicators, collaborating with suppliers as needed.
• Manage the installation, conversion, and qualification of manufacturing tools during factory ramps, ensuring safe and timely execution.
• Develop and optimise excursion prevention systems to safeguard equipment and processes.
• Detect and address discrepant material or activities to maintain process integrity and reliability.
• Participate in technology transfer activities, including training and auditing installations at other sites to ensure consistent manufacturing processes globally.

Behavioral Traits

• Strong problem-solving and analytical skills with the ability to handle complex technical challenges.
• Effective communication and collaboration skills to work across teams and with global counterparts.

Qualifications

• Bachelor's degree in Engineering STEM related field (e.g., Electrical Engineering, Chemistry, Chemical Engineering, Mechanical Engineering, Material Science, Physics, Robotics, Molecular and Nanomaterials, Nanoengineering) with 6+ months of experience in equipment maintenance and/or repair processes within a manufacturing environment.
• This position is not eligible for Intel immigration sponsorship.

Preferred Qualifications

• Master’s degree in engineering STEM related field (e.g., Electrical Engineering, Chemistry, Chemical Engineering, Mechanical Engineering, Material Science, Physics, Robotics, Molecular and Nanomaterials, Nanoengineering).
• Demonstrated commitment to safety and quality in manufacturing operations.
• Understanding of process control techniques, defect analysis, and manufacturing efficiency optimization.

Job Type & Location

Job Type: Shift: Shift 1 (United States of America)

Primary Location: US, Oregon, Hillsboro

Additional Locations: N/A

Position of Trust: N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $76,390.00-146,440.00 USD. The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model

• This role will require an on-site presence.
• Job posting details (such as work model, location or time type) are subject to change.
• Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

EEO Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.