Hybrid Senior Module Equipment Engineer – Semiconductors

Intel Corporation; Hillsboro (OR); Híbrido; USD 115.000 - 220.000; Jornada completa

Descripción de la vacante

Intel Corporation in Hillsboro, Oregon, is seeking a Module Equipment Development Engineer to lead development and optimization of semiconductor manufacturing equipment and processes. You will drive new process capabilities and enable high-performance devices while partnering with global teams to advance future technologies.

Responsibilities include designing experiments, collaborating with suppliers, and supporting technology transfer to high-volume manufacturing with a focus on yield

Formación

• Bachelor's degree in a STEM field with 4+ years in semiconductor processing.
• Experience in lithography, etching, thin film deposition, or planarization.
• Familiarity with JMP, MATLAB, or Python for data analysis.

Responsabilidades

• Develop Equipment capable of delivering on new process requirements in Dielectrics Thin Films.
• Develop robust Equipment modules transferable to high-volume manufacturing.
• Collaborate with suppliers to evaluate and implement novel technologies.
• Support technology transfer to high-volume manufacturing through training and audits.
• Design, execute, and analyze experiments to optimize manufacturing processes.
• Perform feasibility studies to support future device architectures and roadmaps.
• Use SPC and DOE to guide process improvements and yield enhancements.
• Partner with cross-functional teams to ensure seamless process integration.

Conocimientos

Semiconductor processing experience

Lithography

Etching

Thin film deposition

Planarization

Process characterization

Statistical analysis tools (MATLAB, J*

Python

Materials characterization techniques

Educación

Bachelor's degree in Materials Science or related STEM field

Master's degree in relevant STEM field

PhD in Materials Science / Chemical Engineering / Physics / Chemistry

Herramientas

JMP

MATLAB

Python

SEM

TEM

XPS

Ellipsometry

Descripción del empleo

Intel Corporation in Hillsboro, Oregon, is seeking a Module Equipment Development Engineer to lead development and optimization of semiconductor manufacturing equipment and processes. You will drive new process capabilities and enable high-performance devices while partnering with global teams to advance future technologies.

Responsibilities include designing experiments, collaborating with suppliers, and supporting technology transfer to high-volume manufacturing with a focus on yield