Night-Shift WPM Module Equipment Technician (Semiconductor)

Intel Corporation; Hillsboro (OR); Presencial; USD 60.000 - 100.000; Jornada completa

Descripción de la vacante

Intel Corporation in Hillsboro, Oregon is seeking a C4 Module Equipment Technician for the Wafer Packaging Manufacturing (WPM) team. The role focuses on troubleshooting electrical and mechanical issues, assembling and setting up equipment, and performing preventive maintenance while coordinating with suppliers.

You will monitor equipment performance, create failure reports, and collaborate with Module Engineering on experiments and ramp activities.

Formación

• Bachelor's degree in a STEM field or related discipline.
• Associate degree/certification and 1+ years of related equipment maintenance experience.
• High school diploma and military training in a technical field such as electronics, mechanical systems, or a similar technical discipline, plus at least 2.5+ years of experience.
• High school diploma and 2+ years of experience in preventive maintenance, equipment repair, or troubleshooting within a semiconductor manufacturing or industrial manufacturing environment.

Responsabilidades

• Troubleshooting and diagnosing electrical and mechanical issues on manufacturing equipment to identify and resolve operational problems.
• Dismantling, adjusting, repairing, installing, and assembling equipment using layout plans, blueprints, operating manuals, repair manuals, and technical drawings.
• Performing equipment setup, calibration, and preventive maintenance activities, while coordinating with suppliers for specialized service and repair support when required.
• Monitoring and analyzing equipment performance data to drive continuous improvement, maintain optimal tool performance, and address tool or module-related issues.
• Creating reports on system failures, updating existing specifications, and developing new documentation to support equipment reliability and performance.
• Partnering with Module Engineering to execute experiments, implement equipment configuration changes, support data collection efforts, and complete tasks according to established procedures.
• Supporting equipment troubleshooting through data analysis and controlled experimentation aimed at meeting or exceeding module availability and performance targets while preventing future production excursions.
• Collaborating with Module Engineering and construction teams during factory ramp activities to ensure equipment is installed, configured, and converted according to design requirements.

Educación

Bachelor's degree in STEM or related discipline

Associate degree or certification with 1+ years of equipment maintenance experience

High school diploma with military training in electronics/mechanical systems (2.5+ years)

High school diploma with 2+ years in preventive maintenance or equipment repair in semiconductor/manufacturing

Descripción del empleo

Intel Corporation in Hillsboro, Oregon is seeking a C4 Module Equipment Technician for the Wafer Packaging Manufacturing (WPM) team. The role focuses on troubleshooting electrical and mechanical issues, assembling and setting up equipment, and performing preventive maintenance while coordinating with suppliers.

You will monitor equipment performance, create failure reports, and collaborate with Module Engineering on experiments and ramp activities.