Senior Module Equipment Development Engineer

Intel Corporation; Hillsboro (OR); Hybrid; USD 115,000 - 220,000; Full time

Job summary

Intel Corporation in Hillsboro, Oregon seeks a Module Equipment Development Engineer to lead development and optimization of advanced semiconductor manufacturing equipment and processes. You will drive projects that enable high-performance devices and contribute to Intel's leadership in the industry.

In this role you will collaborate with global teams, design experiments, and apply DOE/SPC methods to improve yield and manufacturability. A hybrid on-site/off-site work model is offered.

Qualifications

• Bachelor's degree in STEM with 4+ years of semiconductor processing experience.
• Master's degree with 3+ years of domain-specific experience.
• PhD with 6+ months experience in semiconductor processing.
• Industry experience in lithography, etching, thin film deposition, or planarization.
• Experience with process characterization methods and data analysis tools (JMP, MATLAB, Python).
• Familiarity with materials characterization techniques (SEM, TEM, XPS, ellipsometry).

Responsibilities

• Develop Equipment capable of delivering on new process requirements in Dielectrics Thin Films.
• Develop robust Equipment modules transferable to high-volume manufacturing.
• Collaborate with equipment and material suppliers to evaluate, qualify, and implement novel technologies into manufacturing processes.
• Support technology transfer to high-volume manufacturing through training, audits, and maintaining process consistency across sites.
• Design, execute, and analyze experiments to optimize advanced manufacturing processes, including material selection, equipment metrology, and parameter tuning.
• Perform feasibility studies and pathfinding activities to support innovative device architectures and future technology roadmaps.
• Utilize advanced data analysis methods, including SPC and DOE, to guide process improvements and enhance yield.
• Partner with cross-functional teams to ensure seamless process integration and manufacturability.

Skills

Semiconductor processing

DOE (Design of Experiments)

SPC (Statistical Process Control)

Cross-functional collaboration

Equipment troubleshooting

Materials characterization methods

Education

Bachelor's degree in Materials Science, Chemical Engineering, Physics, Chemistry, Electrical Engineering, or related STEM field

Master's degree in relevant STEM fields

PhD in relevant STEM field

Tools

JMP

MATLAB

Python

XPS

SEM

TEM

Job description

Intel Corporation in Hillsboro, Oregon seeks a Module Equipment Development Engineer to lead development and optimization of advanced semiconductor manufacturing equipment and processes. You will drive projects that enable high-performance devices and contribute to Intel's leadership in the industry.

In this role you will collaborate with global teams, design experiments, and apply DOE/SPC methods to improve yield and manufacturability. A hybrid on-site/off-site work model is offered.