Semiconductor Process Engineer — HVM & Module Dev

Intel Corporation; Hillsboro (OR); On-site; USD 134,000 - 189,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Vacation and retirement programs

Job summary

Intel Corporation in Hillsboro, Oregon, is seeking a Module Development Engineer to drive development, optimization, and high-volume manufacturing transfer of advanced semiconductor processes.

You will work across lithography, etch, deposition, and metrology, applying DOE, statistical modeling, and data analytics to reduce variability and improve yield while collaborating with external tool vendors and internal teams for robust technology transfer.

Qualifications

• Ph.D. in Electrical Engineering, Chemical Engineering, Materials Science & Engineering, Physics, Mechanical, Chemistry, or related STEM field (expected completion prior to start date).
• 6+ months of experience with semiconductor fabrication, process development, device research, materials research, or related semiconductor technology.
• 6+ months in a cleanroom or semiconductor research lab working with fabrication or analytical instrumentation (e.g., ALD, CVD, PVD, plasma etch, CD-SEM, TEM, AFM, spectroscopic ellipsometry).
• Data Science & Automation: 6+ months utilizing statistical methodologies (DOE, SPC) and engineering software for data analysis and automation.
• Device Physics & Integration: specialization in transistor architecture or FEOL/BEOL process integration.

Responsibilities

• Design, execute, and optimize experimental runs to advance semiconductor processes, equipment hardware, and new material capabilities.
• Apply statistical modeling, DOE, and control systems to reduce variability and drive yield enhancement.
• Partner with external tool/material suppliers and internal integration teams to co-develop equipment and process methodologies.
• Resolve equipment, process, and yield excursion root causes to ensure smooth technology transfer from development into high-volume manufacturing.
• Document experimental findings and technical recommendations through reports and presentations.

Skills

Semiconductor fabrication

Statistical modeling

DOE

SPC

Data analysis

Education

Ph.D. in Electrical Engineering or related STEM

Tools

Python

MATLAB

JMP

C#

Job description

Intel Corporation in Hillsboro, Oregon, is seeking a Module Development Engineer to drive development, optimization, and high-volume manufacturing transfer of advanced semiconductor processes.

You will work across lithography, etch, deposition, and metrology, applying DOE, statistical modeling, and data analytics to reduce variability and improve yield while collaborating with external tool vendors and internal teams for robust technology transfer.