Module Engineering Manager: Advanced Packaging Leader

Intel Corporation; Albuquerque (NM); On-site; USD 121,000 - 232,000; Full time

Benefits offered by this job

Health benefits

Stock bonuses

Vacation

Job summary

Intel Corporation in Albuquerque, New Mexico, seeks an experienced Module Engineering Manager within the Wafer Packaging Manufacturing (WPM) group. You will lead a team of engineers to support safe, high-volume manufacturing processes, drive continuous quality improvements, and coordinate cross-functional problem solving across global sites.

You will mentor engineers, develop deep module expertise, and oversee technology transfer for new Die Pick toolsets during factory transitions, while

Qualifications

• Bachelor's degree in engineering, materials science, physics, or a related technical field with 6+ years of relevant experience.
• 2+ years experience leading an engineering or manufacturing team with demonstrated ability to lead teams, manage performance, and drive results in alignment with organizational goals.
• Experience in process characterization, troubleshooting, and process improvement within a high-volume manufacturing environment.
• Experience with manufacturing practices and lean manufacturing principles.
• 4+ years experience with a Master's degree, or 2+ years of experience with a PhD.
• Extensive experience leading engineering teams with a focus on operational excellence and innovation.
• Advanced knowledge of semiconductor processing or packaging technologies.
• Proven ability to collaborate with vendors and drive cross-functional results.
• Exceptional communication and leadership skills with a track record of inspiring and empowering diverse teams.
• Success in developing and implementing strategic plans to enhance engineering capabilities and future manufacturing efficiency.

Responsibilities

• Lead and manage a team of engineers to support safe, high-volume manufacturing processes while driving continuous improvements in quality, output, cost, and yield.
• Provide tactical direction and prioritize activities for sustaining operations, systematic troubleshooting, and process optimization.
• Collaborate with cross-functional engineering and manufacturing teams to address integrated process and equipment challenges.
• Develop and mentor engineers, cultivating technical expertise, leadership skills, and long-term growth opportunities within the team.
• You will also need to develop hands on technical expertise in the modules you own in order to drive the deep technical improvement projects required to drive the team to success.
• Facilitate technology transfer and ensure matched processing across global sites through training sessions and audits.
• Oversee the installation, qualification, and ramp production of Early Tool Sets during factory transitions.
• Mentor and develop an internal technical team to facilitate the qualification and ramp of next generation Die Pick toolsets.
• Develop and execute long-term strategies to enhance engineering capabilities and meet evolving manufacturing requirements.
• Drive results through effective decision-making, goal setting, differentiated performance management, and maintaining accountability.
• Champion a culture of innovation, inclusion, and disciplined execution to achieve operational excellence.

Skills

Team leadership

Process characterization

Lean manufacturing

High-volume manufacturing

Semiconductor packaging

Vendor collaboration

Education

Bachelor's degree in engineering

Master's degree (preferred)

PhD (preferred)

Job description

Intel Corporation in Albuquerque, New Mexico, seeks an experienced Module Engineering Manager within the Wafer Packaging Manufacturing (WPM) group. You will lead a team of engineers to support safe, high-volume manufacturing processes, drive continuous quality improvements, and coordinate cross-functional problem solving across global sites.

You will mentor engineers, develop deep module expertise, and oversee technology transfer for new Die Pick toolsets during factory transitions, while