Microelectronics Wire Bonder: Precision Assembler

PlanIT Group, LLC; Chelmsford (MA); On-site; USD 30,000 - 39,000; Full time

Job summary

PlanIT Group, LLC is seeking a Microelectronics Wire Bonder in Chelmsford, MA for a contract role with potential for long-term employment. The position focuses on fabricating and modifying micro‑circuit modules using wire and ribbon bonding techniques.

The role requires attention to detail, familiarity with bonding equipment, and the ability to follow detailed work instructions. Overtime may be available, with a First Shift schedule in a fast-paced electronics environment.

Qualifications

• Familiarity with bonding microelectronic components and manual gold ball and ribbon bonding.
• Familiarity with manual and automatic bonding equipment.
• Basic computer skills for timekeeping, work instructions, and task confirmation.
• Attention to detail in a fast-paced environment.
• Able to follow written and verbal instructions.
• Willingness to learn J-STD-001 and IPC-A-610.
• Knowledge of ESD procedures and test equipment.
• High school diploma or GED.

Responsibilities

• Fabricate microelectronic components and sub-assemblies using wire and ribbon bonding on manual and automatic bonding machines.
• Use microscopes and measurement tools to ensure quality.
• Read and interpret assembly instructions and processes.
• Work with small components requiring magnification throughout the shift.
• Use hand tools and pneumatic tools as needed.
• Maintain accurate production data entry.
• Collaborate with team to improve throughput and drive continuous improvement.

Skills

Microelectronics bonding

Manual gold ball bonding

Ribbon bonding

Reading instructions

Quality emphasis

Education

High school diploma or GED

Tools

Bonding equipment

Microscopes

Electronic test equipment

Measuring instruments

Job description

PlanIT Group, LLC is seeking a Microelectronics Wire Bonder in Chelmsford, MA for a contract role with potential for long-term employment. The position focuses on fabricating and modifying micro‑circuit modules using wire and ribbon bonding techniques.

The role requires attention to detail, familiarity with bonding equipment, and the ability to follow detailed work instructions. Overtime may be available, with a First Shift schedule in a fast-paced electronics environment.