Microelectronic Bonder: Precision Wire Bonding & Hybrids

Lehigh Heavy Forge Corporation; Chelmsford (MA); On-site; USD 47,000 - 88,000; Full time

Benefits offered by this job

Medical benefits

Dental benefits

401(k) match

Flexible work arrangements

Job summary

Lockheed Martin Missiles & Fire Control in Chelmsford, MA seeks a Microelectronic Bonder to perform high-precision wire-bonding and hybrid circuit fabrication, supporting mission-critical defense systems.

Qualifications include a high school diploma or GED and the ability to obtain a Secret clearance (U.S. citizenship required). Familiarity with bonding and ESD procedures is preferred. This is a full-time role on-site in Chelmsford.

Qualifications

• High school diploma or GED required.
• Ability to obtain and maintain a Secret security clearance, which requires U.S. citizenship.
• Familiarity with bonding microelectronic components and manual gold ball and ribbon bonding.
• Knowledge of ESD procedures and test equipment.

Responsibilities

• Executes high-precision wire-bonding and hybrid circuit fabrication tasks.
• Performs fabrication or modification tasks on hybrid microcircuits and sub-assemblies.
• Troubleshoots defective hybrids by visual or mechanical screening, wirebonds, or chip placement.

Skills

Bonding microelectronics

Manual/Ball & Ribbon bonding

Detail-oriented

Fast-paced environment

Follow instructions

Education

High school diploma or GED

Tools

Manual bonding equipment

Automatic bonding equipment

Digital timekeeping systems

Job description

Lockheed Martin Missiles & Fire Control in Chelmsford, MA seeks a Microelectronic Bonder to perform high-precision wire-bonding and hybrid circuit fabrication, supporting mission-critical defense systems.

Qualifications include a high school diploma or GED and the ability to obtain a Secret clearance (U.S. citizenship required). Familiarity with bonding and ESD procedures is preferred. This is a full-time role on-site in Chelmsford.