Microelectronic Bonder: High-Precision Wire Bonding

Lockheed Martin; Chelmsford (MA); On-site; USD 47,000 - 88,000; Full time

Benefits offered by this job

Medical insurance

Dental insurance

Vision insurance

401(k) match

Paid time off

Holidays

Parental Leave

Flexible schedules

Job summary

Lockheed Martin Missiles & Fire Control in Chelmsford, MA is seeking a Microelectronic Bonder to perform high-precision wire-bonding and hybrid circuit fabrication for critical defense systems.

You will work with small pad sizes, diverse substrates, and strict quality standards in a team environment, with opportunities for professional growth and comprehensive benefits. Candidates must be U.S. citizens and able to obtain a Secret clearance.

Qualifications

• Ability to work 10 hours under a microscope and use hand tools.
• Good dexterity and eye/hand coordination.
• Experience in wirebonding and/or ribbon bonding (0.001” and 0.0007” wire).
• Experience in microelectronics assembly (chip and wire assembly).
• Ability to read and work from detailed work instructions and drawings; computer skills required.
• Ability to work in a team environment; strong interpersonal and communication skills.
• Ability to obtain and maintain a Secret Security Clearance, which requires U.S. citizenship.

Responsibilities

• Performs fabrication or modification tasks on hybrid microcircuits and sub-assemblies.
• Performs fabrication of hybrid microcircuits; e.g., aluminum and gold wirebonding under conditions such as small pad sizes down to .001 inch squares, very high semiconductor chip density, unusual substrate configurations which require special setup and bonding techniques.
• Requires the capability to troubleshoot defective hybrids by visual or mechanical screening, wirebonds or chip placement.

Skills

Wirebonding

Ribbon bonding

Microelectronics assembly

Reading drawings

Teamwork

Secret clearance

Citizenship required

Microscope work

Tools

Westbond bonding machine

Metcal bonding machine

Unitech welder

Auto pick-and-place

Job description

Lockheed Martin Missiles & Fire Control in Chelmsford, MA is seeking a Microelectronic Bonder to perform high-precision wire-bonding and hybrid circuit fabrication for critical defense systems.

You will work with small pad sizes, diverse substrates, and strict quality standards in a team environment, with opportunities for professional growth and comprehensive benefits. Candidates must be U.S. citizens and able to obtain a Secret clearance.