Wire Bonding Technician — Precision Electronics & Growth

Microchip Technology Inc.; United States; On-site; USD 32,000 - 48,000; Full time

Benefits offered by this job

Health benefits from day one

Job summary

Microchip Technology Inc. is seeking a Manufacturing Technician in the Discrete Products Group to join our high-precision wire bonding team in the US.

You will contribute to the production of power and RF/microwave discrete components, ensuring quality through manual and automated bonding techniques. The role requires 2+ years in wire bonding, strong manual dexterity, and the ability to read drawings and process specs.

Qualifications

• High school diploma or equivalent; technical degree preferred.
• Minimum of 2 years experience in wire bonding or semiconductor manufacturing.
• Ability to read technical drawings and process specifications.
• Proficiency with automated and manual wire bonding equipment.
• Strong dexterity, attention to detail, and safe work practices.

Responsibilities

• Perform manual wire bonding tasks using microscopes and bonding tools.
• Inspect and test wire bonds to ensure quality and specs.
• Set up wire bond equipment, change tools/wires, and troubleshoot issues.
• Maintain production data records and equipment maintenance logs.
• Collaborate with engineering/QA to improve processes and quality.
• Adhere to cleanroom protocols and safety guidelines.
• Participate in continuous improvement and training programs.
• Assist in training new technicians and support staff.
• Perform other tasks and assist on various projects.

Skills

Wire bonding

Semiconductor manufacturing

Reading drawings

Manual dexterity

Teamwork

Problem solving

Education

High school diploma or equivalent

Technical degree or electronics certification

Tools

Automated wire bonding machinery

Manual wire bonding equipment

Microscopes

Bonding tools

Job description

Microchip Technology Inc. is seeking a Manufacturing Technician in the Discrete Products Group to join our high-precision wire bonding team in the US.

You will contribute to the production of power and RF/microwave discrete components, ensuring quality through manual and automated bonding techniques. The role requires 2+ years in wire bonding, strong manual dexterity, and the ability to read drawings and process specs.