Precision Wire Bonding Technician (Manual & Microscope)

Microchip Technology Inc; Lawrence (MA); On-site; USD 30,000 - 48,000; Full time

Job summary

Microchip Technology Inc. is seeking a detail-oriented Manufacturing Technician for the Discrete Products Group.

You will work in component manufacturing and perform automated and manual aluminum wire bonding, often under microscopes, to connect small die with high precision. The role requires 2+ years in wire bonding or semiconductor manufacturing, strong manual dexterity, and the ability to read process specs.

Qualifications

• High school diploma or equivalent; technical degree preferred.
• Minimum of 2 years in wire bonding or semiconductor manufacturing.
• Proficiency with automated and manual wire bonding.
• Ability to read drawings and process specifications.
• Excellent manual dexterity and visual acuity for very small die.
• Good communication and teamwork.

Responsibilities

• Operate wire bonding machines and equipment with precision according to SOPs.
• Perform manual wire bonding tasks with microscopes and bonding tools.
• Inspect and test wire bonds to ensure quality and specs.
• Perform wire bond equipment setup including tool and wire changes; troubleshoot issues to minimize downtime.
• Maintain accurate records of production data and maintenance.
• Collaborate with engineering and QA teams to improve processes and product quality.
• Adhere to cleanroom protocols and safety guidelines.
• Participate in continuous improvement initiatives and training to enhance skills.
• Assist in training new technicians and support staff as required.
• Perform other tasks as needed.

Skills

Wire bonding

Semiconductor manufacturing

Manual wire bonding

Microelectronics

Education

High school diploma

Electronics certification

Tools

Wire bonding machinery

Microscopes

Bonding tools

Job description

Microchip Technology Inc. is seeking a detail-oriented Manufacturing Technician for the Discrete Products Group.

You will work in component manufacturing and perform automated and manual aluminum wire bonding, often under microscopes, to connect small die with high precision. The role requires 2+ years in wire bonding or semiconductor manufacturing, strong manual dexterity, and the ability to read process specs.