Contract Wire Bonder - Microelectronics (Secret)

D.O.M. magazine; Chelmsford (MA); On-site; USD 45,000 - 65,000; Full time

Benefits offered by this job

401(k)

Short-term disability insurance

Free career counseling services

Job summary

PDS Defense, Inc. is seeking a Microelectronics Wire Bonder for an exciting contract opportunity in Chelmsford, MA. This role involves fabricating complex micro-circuit modules using wire and ribbon bonding techniques. Candidates should have a keen eye for detail and be familiar with electronic components.

The position requires working full-time during the first shift, Monday through Thursday. Skills in bonding techniques and a high school diploma are essential. Benefits include 401(k), medical coverage, and paid holidays.

Qualifications

• Experience with manual gold ball and ribbon bonding techniques.
• Ability to follow written and verbal instructions.
• Strong work ethic, punctuality, and reliability.

Responsibilities

• Fabricate microelectronic components and sub-assemblies.
• Use hand and pneumatic tools as necessary.
• Collaborate with team members to improve throughput.

Skills

Familiarity with bonding microelectronic components

Basic computer skills

Strong attention to detail

Willingness to learn J-STD-001 or IPC-A-610

Knowledge of ESD procedures

Education

High school diploma or GED

Tools

Manual and automatic bonding machines

Microscopes

Measuring instruments

Electronic test equipment

Job description

PDS Defense, Inc. is seeking a Microelectronics Wire Bonder for an exciting contract opportunity in Chelmsford, MA. This role involves fabricating complex micro-circuit modules using wire and ribbon bonding techniques. Candidates should have a keen eye for detail and be familiar with electronic components.

The position requires working full-time during the first shift, Monday through Thursday. Skills in bonding techniques and a high school diploma are essential. Benefits include 401(k), medical coverage, and paid holidays.