Microelectronic Bonder: High-Precision Wire Bonding

Lockheed Martin; Chelmsford (MA); On-site; USD 47,000 - 88,000; Full time

Benefits offered by this job

Medical, Dental, Vision

401(k) match

Paid time off

4x10 work schedule

Job summary

Lockheed Martin Missiles & Fire Control in Chelmsford, MA is seeking a Microelectronic Bonder to perform high‑precision wire‑bonding and hybrid circuit fabrication for defense systems. You will fabricate and modify hybrids, troubleshoot using visual/ohmmeter methods, and ensure quality in a weekend shift.

The role requires a high school diploma, US citizenship, and ability to obtain a Secret clearance. The team emphasizes safety, accuracy, and a commitment to learning advanced bonding techniques.

Qualifications

• High school diploma or GED required.
• US citizenship with ability to obtain Secret clearance.

Responsibilities

• Execute high-precision wire-bonding and hybrid circuit fabrication tasks.
• Fabricate and modify hybrids and sub-assemblies.
• Troubleshoot defective hybrids by visual or mechanical screening and by using an ohmmeter.

Skills

Bonding microelectronic components

Manual gold ball bonding

Manual bonding equipment

Digital systems for timekeeping

Attention to detail

Learn J-STD-001 & IPC-A-610

ESD procedures & test equipment

Punctuality & reliability

Education

High school diploma or GED

Job description

Lockheed Martin Missiles & Fire Control in Chelmsford, MA is seeking a Microelectronic Bonder to perform high‑precision wire‑bonding and hybrid circuit fabrication for defense systems. You will fabricate and modify hybrids, troubleshoot using visual/ohmmeter methods, and ensure quality in a weekend shift.

The role requires a high school diploma, US citizenship, and ability to obtain a Secret clearance. The team emphasizes safety, accuracy, and a commitment to learning advanced bonding techniques.