Microelectronics Bonder – High-Precision Wire Bonding

Lockheed Martin; Chelmsford (MA); On-site; USD 47,000 - 88,000; Full time

Benefits offered by this job

Medical, Dental, Vision

4x10 work schedule

401(k) match

Job summary

Lockheed Martin Missiles & Fire Control seeks a Microelectronic Bonder in Chelmsford, MA. You will perform high‑precision wire‑bonding and hybrid circuit fabrication, including aluminum and gold wirebonding on very small pads and dense chip layouts.

You will troubleshoot defective hybrids, assemble substrates in special packages, and solder coils to complete sub‑assemblies. U.S. citizenship and Secret clearance are required.

Qualifications

• High school diploma or GED is required.
• Ability to obtain and maintain a Secret clearance (US citizenship required).
• Familiar with bonding microelectronic components and manual gold ball/ribbon bonding.
• Experience with manual and automatic bonding equipment is preferred.

Responsibilities

• Execute high‑precision wire‑bonding and hybrid circuit fabrication tasks.
• Fabricate hybrid microcircuits using aluminum and gold wirebonding with small pad sizes.
• Troubleshoot defective hybrids by visual or mechanical screening and chip placement.
• Mount substrates in non‑standard packages and attach feedthrough pins.
• Perform soldering of coils and final assembly of assemblies.

Skills

Bonding microelectronics

Gold ball bonding

Ribbon bonding

ESD procedures

Attention to detail

Follow instructions

Education

High school diploma or GED

Tools

Bonding equipment

Job description

Lockheed Martin Missiles & Fire Control seeks a Microelectronic Bonder in Chelmsford, MA. You will perform high‑precision wire‑bonding and hybrid circuit fabrication, including aluminum and gold wirebonding on very small pads and dense chip layouts.

You will troubleshoot defective hybrids, assemble substrates in special packages, and solder coils to complete sub‑assemblies. U.S. citizenship and Secret clearance are required.