Memory Packaging Architect: Pathfinding Next-Gen AI Systems

Micron Technology; Boise (ID); On-site; USD 143,000 - 398,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time off and holidays

Benefits guide and programs

Job summary

Micron Technology is seeking a senior packaging pathfinding expert to drive next‑generation memory system architectures from datacenter to edge‑AI. You will define cross‑stack optimizations across silicon, package, board and system, guiding long‑term package technology direction and collaborating with customers to translate ideas into scalable products and roadmaps.

You will interface across package process tech, materials, electrical, thermo‑mechanical and system performance to influence

Qualifications

• Master’s degree in EE, CE, CS, or related field.
• 6+ years hands-on memory systems packaging, signaling and IO/PDN design.
• Strong memory timing, signaling and power understanding.
• Experience with Cadence, Siemens and Ansys packaging tools.
• Experience applying AI or LLMs for engineering efficiency.

Responsibilities

• Define next‑generation package pathfinding and system architectures for speed, bandwidth, power and thermal performance.
• Lead cross‑stack co‑optimization across silicon, package, board and system.
• Drive long‑term memory packaging strategy and influence standards.
• Collaborate with silicon, system design teams and customers for future solutions.
• Serve as technical interface to internal partners and leaders.
• Develop AI-based multi‑physics solutions for efficiency gains.

Skills

Memory packaging

Signal integrity

IO design

PDN design

AI for engineering

Education

Master’s degree in EE/CE/CS

Tools

Cadence

Siemens

Ansys

Job description

Micron Technology is seeking a senior packaging pathfinding expert to drive next‑generation memory system architectures from datacenter to edge‑AI. You will define cross‑stack optimizations across silicon, package, board and system, guiding long‑term package technology direction and collaborating with customers to translate ideas into scalable products and roadmaps.

You will interface across package process tech, materials, electrical, thermo‑mechanical and system performance to influence