Memory Package Integration Architect

Micron Technology; Boise (ID); On-site; USD 143,000 - 398,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time off and holidays

Benefits guide and programs

Job summary

Micron Technology is seeking a senior packaging pathfinding expert to drive next‑generation memory system architectures from datacenter to edge‑AI. You will define cross‑stack optimizations across silicon, package, board and system, guiding long‑term package technology direction and collaborating with customers to translate ideas into scalable products and roadmaps.

You will interface across package process tech, materials, electrical, thermo‑mechanical and system performance to influence

Qualifications

• Master’s degree in EE, CE, CS, or related field.
• 6+ years hands-on memory systems packaging, signaling and IO/PDN design.
• Strong memory timing, signaling and power understanding.
• Experience with Cadence, Siemens and Ansys packaging tools.
• Experience applying AI or LLMs for engineering efficiency.

Responsibilities

• Define next‑generation package pathfinding and system architectures for speed, bandwidth, power and thermal performance.
• Lead cross‑stack co‑optimization across silicon, package, board and system.
• Drive long‑term memory packaging strategy and influence standards.
• Collaborate with silicon, system design teams and customers for future solutions.
• Serve as technical interface to internal partners and leaders.
• Develop AI-based multi‑physics solutions for efficiency gains.

Skills

Memory packaging

Signal integrity

IO design

PDN design

AI for engineering

Education

Master’s degree in EE/CE/CS

Tools

Cadence

Siemens

Ansys

Job description

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

We are the team defining the future of packaging of complex memory systems! Our Package pathfinding and Architecture organization sits at the intersection of silicon, packaging, systems, and customer needs—turning complex scaling challenges into technologies that power next generation platforms, through cutting edge packaging technologies. If you enjoy working on problems with real industry impact, look no further!

This is a technical pathfinding role driving forward-looking packaging technology for next generation memory systems from datacenter to edge-AI. You will leverage understanding of end to end memory system architectures, to guide long term package technology direction, and partner with customers, to build innovative ideas into scalable products. You will interface between package process technology, materials, electrical, thermo-mechanical and system performance areas to guide the package strategic roadmaps for Micron.

Responsibilities

• Define next‑generation package pathfinding and system architectures optimizing for speed performance, system bandwidth, power, capacity, thermal, mechanical and electrical performance.
• Lead cross‑stack co‑optimization across silicon, package, board, and system with package centric solutions approach
• Drive long‑term memory technology packaging strategy and influence industry standards
• Work closely with silicon, and system design teams and customers for next generation and long term disruptive solutions to boost speed performance for edge-AI and datacenter memory products
• Serve as a technical interface to internal partners, customers, BUs, senior leaders.
• Develop AI based multi-physics solutions for efficiency gains

Minimum Qualifications

• Master’s degree or equivalent practical experience in EE, CE, CS, or related field
• 6+ years of Extensive hands‑on experience in memory systems package design, signaling, IO design, PDN design
• Deep understanding of memory timing, signaling, power, package process technology
• working knowledge of EDA tools for design, analysis and simulation of electronic packaging, including but not limited to Cadence, Siemens and Ansys tools
• Experience applying AI or LLMs for engineering efficiency

Preferred Qualifications

• Master’s degree or PhD in a related technical field
• Recognized technical leadership across multiple products
• Experience in Signal and Power integrity analysis and mechanical and reliability analysis, thermal analysis
• Expertise in memory systems architecture

The US base salary range that Micron Technology estimates it could pay for this full-time position is:

$143,000.00 - $398,000.00 a year

Additional Compensation May Include Benefits, Bonuses And Equity.

• Micron offers a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
• Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.
• Additionally, Micron benefits include a robust paid time-off program and paid holidays.
• For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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To learn more about Micron, please visit micron.com/careers

US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at [e-mail] or 1-800-336-8918 (select option #3)

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.