Memory Packaging Architect-Pathfinding for AI-Scale Systems

Micron Technology; San Jose (CA); On-site; USD 143,000 - 398,000; Full time

Job summary

Micron Technology in San Jose is seeking a seasoned engineer for a technical pathfinding role in memory packaging. You will define next-generation package architectures, optimize across silicon, package, board, and system, and partner with customers to translate complex requirements into scalable solutions.

You’ll collaborate with silicon, materials, electrical, thermo-mechanical and system-performance teams to develop AI-based multi-physics approaches that improve speed, bandwidth, power and

Qualifications

• Master’s degree or equivalent practical experience in EE, CE, CS, or related field.
• 6+ years of extensive hands‑on experience in memory systems package design, signaling, IO design, PDN design.
• Experience using Cadence, Siemens, and Ansys tools for packaging design and analysis.
• Experience applying AI or LLMs for engineering efficiency.

Responsibilities

• Define next‑generation package pathfinding and system architectures optimizing speed, bandwidth, and power.
• Lead cross‑stack co‑optimization across silicon, package, board, and system with package-centric solutions.
• Drive long‑term memory technology packaging strategy and influence industry standards.
• Collaborate with silicon and system design teams and customers for next generation and long-term disruptive solutions to boost speed for edge-AI and datacenter memory products.
• Serve as a technical interface to internal partners, customers, BUs, senior leaders.
• Develop AI based multi-physics solutions for efficiency gains.

Skills

Memory timing

Packaging design

Power integrity

AI/LLMs for engineering

Education

Master’s degree

PhD (preferred)

Tools

Cadence

Siemens

Ansys

Job description

Micron Technology in San Jose is seeking a seasoned engineer for a technical pathfinding role in memory packaging. You will define next-generation package architectures, optimize across silicon, package, board, and system, and partner with customers to translate complex requirements into scalable solutions.

You’ll collaborate with silicon, materials, electrical, thermo-mechanical and system-performance teams to develop AI-based multi-physics approaches that improve speed, bandwidth, power and