Memory Package Architect — Next-Gen AI & Datacenter

Micron Technology, Inc; Boise, Northern (ID, KY); Hybrid; USD 143,000 - 398,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time off and holidays

Equity and bonuses

Job summary

Micron Technology, Inc. in Boise seeks a Memory Package Integration Architect to define next-generation memory packaging architectures, driving cross‑stack optimization across silicon, package and system for high-speed datacenter and edge-AI memory products.

You will work with silicon, electrical, thermal and mechanical teams, interfacing with customers and senior leaders to guide long-term technology roadmaps and disruptive packaging innovations.

Qualifications

• 6+ years of extensive hands‑on experience in memory systems package design, signaling, IO design, PDN design.
• Deep understanding of memory timing, signaling, power, package process technology.
• Experience applying AI or LLMs in engineering workflows

Responsibilities

• Define next-generation package pathfinding and system architectures optimizing for speed, bandwidth, power and thermal.
• Lead cross-stack co-optimization across silicon, package, board and system with package-centric solutions.
• Drive long-term memory packaging strategy and influence industry standards.
• Collaborate with silicon, system design teams and customers for disruptive edge-AI and datacenter memory solutions.
• Interface with internal partners, customers and leadership to align roadmaps and priorities.

Skills

Memory system architecture

AI/LLM tooling awareness

Cross-functional collaboration

Education

Master’s degree or equivalent in EE/CE/CS

PhD preferred

Tools

Cadence

Siemens

Ansys

Job description

Micron Technology, Inc. in Boise seeks a Memory Package Integration Architect to define next-generation memory packaging architectures, driving cross‑stack optimization across silicon, package and system for high-speed datacenter and edge-AI memory products.

You will work with silicon, electrical, thermal and mechanical teams, interfacing with customers and senior leaders to guide long-term technology roadmaps and disruptive packaging innovations.