Lead Photonic Packaging Design & Integration Engineer

Global Foundries; Essex Junction (VT); On-site; USD 132,000 - 242,000; Full time

Job summary

GlobalFoundries in Essex Junction, VT is seeking a Photonic Packaging Design Integration Engineer to lead the development and sustainment of advanced optical packaging for silicon photonics and co-packaged optics platforms.

You will collaborate with photonics, electrical, mechanical, and manufacturing teams to deliver scalable, low‑loss, and cost‑effective packaging architectures that meet stringent performance and reliability targets.

Qualifications

• MS or PhD in a relevant field with extensive experience.
• Strong written and spoken English communication skills.
• Experience bringing packaged products from development into production.
• Advanced packaging design and layout expertise.

Responsibilities

• Drives SiPh advanced packaging product innovations and design enablement.
• Supports new customer products with innovative design solutions.
• Drives design reviews with cross functional teams.
• Drives cross function teams to resolve technical & yield concerns.
• Develops engineers skills in packaging design constraints.
• Develops complex analysis models for manufacturability, cost, and quality.
• Ensures requirements are met and performance aligns with customer expectations.
• Drives discipline and qualification robustness through global processes.
• Drives CIP to deliver organizational goals.

Skills

English communication

Education

MS or PhD in relevant field

Tools

HFSS

Zmax

Flotherm

Job description

GlobalFoundries in Essex Junction, VT is seeking a Photonic Packaging Design Integration Engineer to lead the development and sustainment of advanced optical packaging for silicon photonics and co-packaged optics platforms.

You will collaborate with photonics, electrical, mechanical, and manufacturing teams to deliver scalable, low‑loss, and cost‑effective packaging architectures that meet stringent performance and reliability targets.