Lead Optical Packaging Engineer (SiPh & CPO)

GlobalFoundries inc.; Essex, Northern (MD, KY); Hybrid; USD 143,000 - 247,000; Full time

Job summary

GlobalFoundries inc. is seeking a Packaging Integration Engineer to lead optical packaging architectures for silicon photonics modules, including fiber attach and photonic die placement. You will drive 2.5D/3D/3.5D HI packaging, work with OSATs, and optimize reliability through multiphysics simulations.

The role requires a Master’s degree and 8+ years in semiconductor packaging with strong communications skills. Travel up to 25% to GF facilities or partners is expected.

Qualifications

• Master’s degree or higher in Packaging, Materials Science, Mechanical Engineering, Optical Engineering or related field.
• 8+ years in semiconductor packaging, with photonic/advanced packaging focus.
• Hands-on experience with fiber attach, photonic alignment, and optical coupling.

Responsibilities

• Define, design, and qualify optical packaging architectures for SiPh modules.
• Develop scalable fiber-to-chip coupling strategies for high-density I/O.
• Lead HI packaging using 2.5D/3D/3.5D methods and advanced bonding techniques.
• Perform multiphysics simulations to optimize performance and reliability.
• Drive root cause analysis for yield/reliability using FMEA/DOE/FA.
• Collaborate with OSATs and internal teams for mass production readiness.

Skills

Fiber attach processes

Photonic alignment

Optical coupling techniques

Multiphysics analysis

Root cause analysis

Education

Master’s degree in Packaging/Mechanical/Optical Engineering

Tools

Lumerical

COMSOL

Fotonix platform

OSAT collaboration tools

Job description

GlobalFoundries inc. is seeking a Packaging Integration Engineer to lead optical packaging architectures for silicon photonics modules, including fiber attach and photonic die placement. You will drive 2.5D/3D/3.5D HI packaging, work with OSATs, and optimize reliability through multiphysics simulations.

The role requires a Master’s degree and 8+ years in semiconductor packaging with strong communications skills. Travel up to 25% to GF facilities or partners is expected.