Lead Photonic Packaging Engineer - SiPh & HI

GLOBALFOUNDRIES U.S. INC.; Essex Junction (VT); On-site; USD 107,000 - 205,000; Full time

Job summary

GlobalFoundries U.S. INC. is seeking a Photonic Packaging Engineer for its Advanced Packaging and Photonics Center.

You will lead development and sustainment of advanced optical packaging for silicon photonics and co-packaged optics, collaborating across photonics, electrical, mechanical, and manufacturing teams. You will define packaging architectures, drive 2.5D/3D integration, perform multiphysics simulations, and lead root-cause actions for yield and reliability.

Qualifications

• Master’s degree or higher in Packaging, Materials Science, Mechanical Engineering, or related field.
• 5+ years of experience in semiconductor packaging, with a focus on photonic or advanced packaging.
• Hands-on experience with fiber attach processes, photonic alignment, and optical coupling techniques.
• Familiarity with packaging technologies such as die attach, flip-chip, underfill, molding, and micro-optics integration.
• Understanding of reliability standards and qualification methodologies for optical modules.
• Excellent analytical, problem-solving, and communication skills.
• Experience in bringing packaged products from development into production.
• Strong written and spoken English communication skills.

Responsibilities

• Own the definition, design, and qualification of optical packaging architectures for SiPh-based modules, including fiber attach, photonic die placement, and thermal/mechanical integration.
• Develop and implement scalable fiber-to-chip coupling strategies for high-density optical I/O.
• Drive heterogeneous integration (HI) of photonic and electronic components using 2.5D/3D/3.5D packaging technologies.
• Perform multiphysics simulations (thermal, mechanical, optical) to optimize package performance and reliability.
• Lead root cause analysis and corrective actions for yield and reliability issues using FMEA, DOE, and FA tools.
• Collaborate with OSATs and internal manufacturing teams to ensure mass production readiness and process transfer.

Education

Master's degree

Tools

Python

Lumerical

COMSOL

Job description

GlobalFoundries U.S. INC. is seeking a Photonic Packaging Engineer for its Advanced Packaging and Photonics Center.

You will lead development and sustainment of advanced optical packaging for silicon photonics and co-packaged optics, collaborating across photonics, electrical, mechanical, and manufacturing teams. You will define packaging architectures, drive 2.5D/3D integration, perform multiphysics simulations, and lead root-cause actions for yield and reliability.