Senior SiPh Packaging & Assembly Architect

GlobalFoundries inc.; Essex (VT); On-site; USD 166,000 - 291,000; Full time

Job summary

GlobalFoundries inc. seeks a senior expert to drive the Photonix packaging strategy, advancing electro-optical transceivers and 2.5D/3D co-packaged optics. The role focuses on reliability plans, materials selection, and IP alignment for data centers, automotive, and communications.

Responsibilities include leading design reviews, mentoring engineers, and coordinating with OSAT partners to deliver robust, scalable packaging solutions and fast time-to-market for next-generation interfaces.

Qualifications

• MS or PhD with 20+ years of experience in photonics packaging.
• Expert in photonic and electronic package architecture.
• Experience bringing packaged products from development into production for data centers, automotive and communications.
• Strong knowledge of 2D/2.5D/3D SiPh advanced packaging.

Responsibilities

• Lead packaging design reviews and mentor engineers.
• Define reliability plans, test methods, and qualification strategies.
• Collaborate with OSAT ecosystems to scale production.
• Define interfaces for chiplet and photonic modules.

Skills

Photonic and electronic packaging

2D/2.5D/3D SiPh packaging

Product definition & design reviews

Materials selection & FMEA

Education

MS or PhD + 20+ years experience

Job description

GlobalFoundries inc. seeks a senior expert to drive the Photonix packaging strategy, advancing electro-optical transceivers and 2.5D/3D co-packaged optics. The role focuses on reliability plans, materials selection, and IP alignment for data centers, automotive, and communications.

Responsibilities include leading design reviews, mentoring engineers, and coordinating with OSAT partners to deliver robust, scalable packaging solutions and fast time-to-market for next-generation interfaces.