Senior SiPh Packaging & 3D Optics Architect

GLOBALFOUNDRIES; Austin (TX); On-site; USD 166,000 - 291,000; Full time

Job summary

GlobalFoundries is seeking an DMTS-grade expert to lead Photonix packaging development, focusing on 2.5D/3D interconnects. You will shape product definition for photonic and electronic packages and collaborate with OSAT partners to enable high‑speed data center solutions.

The role demands 20+ years in photonics packaging, with a strong track record in reliability, test methodologies, and cross‑functional leadership across GF and industry ecosystems.

Qualifications

• MS or PhD with 20+ years of experience in photonics packaging.
• Expertise in photonic and electronic package architecture definition.
• Experience bringing packaged products from development into production.
• Leadership in global SiPh advanced packaging and OSAT ecosystems.

Responsibilities

• Hands-on subject matter expert for SiPh packaging and training across GF teams.
• Lead packaging design reviews, materials selection and FMEAs.
• Ensure quality maturity aligns with industry expectations for data centers, automotive and communications.
• Drive innovation and standardization across global packaging programs.
• Support safe operations and environmental, health, safety requirements.

Skills

Photonic packaging architecture

Electronic packaging

Chiplet integration

2.5D/3D SiPh packaging

Test and qualification strategy

Education

MS or PhD in a related field

Job description

GlobalFoundries is seeking an DMTS-grade expert to lead Photonix packaging development, focusing on 2.5D/3D interconnects. You will shape product definition for photonic and electronic packages and collaborate with OSAT partners to enable high‑speed data center solutions.

The role demands 20+ years in photonics packaging, with a strong track record in reliability, test methodologies, and cross‑functional leadership across GF and industry ecosystems.