Lead Layout Architect for Next-Gen HBM Analog & Mixed-Signal

Micron Technology, Inc; Richardson (TX); On-site; USD 100,564 - 168,067; Full time

Job summary

Micron Technology, Inc. is seeking a Principal Layout Designer for next‑generation HBM architecture.

You will drive analog and mixed‑signal layout for 3D‑stacked memories, collaborating with architecture, design and packaging teams to prove feasibility and identify optimizations. Responsibilities include layout for critical blocks, floorplanning, placement and routing, LVS/DRC verification, and thorough documentation.

Qualifications

• Hands-on layout experience with analog blocks and full designs.
• Strong understanding of analog layout fundamentals and parasitics.
• Experience with LVS/DRC verification and layout quality checks.

Responsibilities

• Design layouts for critical analog and mixed-signal blocks.
• Lead layout exploration: floorplanning, placement, routing.
• Integrate full chip designs and perform LVS/DRC with documentation.
• Collaborate across domains (SI, architecture, packaging) for exploration.

Skills

Analog layout

Mixed-signal layout

LVS/DRC verification

Parasitics understanding

Education

Bachelor’s or Master’s in EE/CE/CS

Tools

Cadence VLE/VXL

Mentor Calibre DRC/LVS

Job description

Micron Technology, Inc. is seeking a Principal Layout Designer for next‑generation HBM architecture.

You will drive analog and mixed‑signal layout for 3D‑stacked memories, collaborating with architecture, design and packaging teams to prove feasibility and identify optimizations. Responsibilities include layout for critical blocks, floorplanning, placement and routing, LVS/DRC verification, and thorough documentation.