Lead Analog IP Architect for High-Bandwidth Memory (HBM)

Micron Technology, Inc

Richardson (TX)

On-site

USD 120,000 - 150,000

Full time

14 days+

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Job summary

Micron Technology, Inc in Richardson, Texas is seeking a Principal Analog Design Engineer to lead the design and integration of advanced analog and mixed-signal IPs for High Bandwidth Memory (HBM) products. This key role focuses on creating high-performance analog subsystems, ensuring power efficiency and reliability in groundbreaking technology.

The ideal candidate will have a MS or PhD in Electrical Engineering, along with 10–15 years of experience in analog/mixed-signal IC design and a thorough understanding of high-speed interfaces and CMOS processes. The position offers exposure to cross-functional collaboration and significant exposure in semiconductor design.

Qualifications

  • 10-15+ years of experience in analog/mixed-signal IC design.
  • Proven expertise in high-speed interface design and clocking circuits.
  • Deep understanding of advanced CMOS processes and noise issues.

Responsibilities

  • Lead the design of HBM analog circuits including transmitters and receivers.
  • Conduct PVT, Monte Carlo, and mismatch analyses.
  • Collaborate with layout engineers for design requirements.

Skills

High-speed interface design
Analog/mixed-signal IC build
Clocking circuits
Power management circuits
Analog IP integration
Silicon validation
SPICE simulation

Education

MS or PhD in Electrical Engineering or related field

Job description

Micron Technology, Inc in Richardson, Texas is seeking a Principal Analog Design Engineer to lead the design and integration of advanced analog and mixed-signal IPs for High Bandwidth Memory (HBM) products. This key role focuses on creating high-performance analog subsystems, ensuring power efficiency and reliability in groundbreaking technology.

The ideal candidate will have a MS or PhD in Electrical Engineering, along with 10–15 years of experience in analog/mixed-signal IC design and a thorough understanding of high-speed interfaces and CMOS processes. The position offers exposure to cross-functional collaboration and significant exposure in semiconductor design.

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