Principal Layout Designer - Analog/Mixed-Signal for HBM

Micron Memory Malaysia Sdn Bhd; Richardson (TX); On-site; USD 85,411 - 168,067; Full time

Job summary

Micron Technology in Richardson, TX seeks a Principal Layout Designer in the Next-generation HBM Architecture Team to drive analog and mixed-signal layouts for 3D-stacked memory designs. You will collaborate with architecture, design, and packaging teams to enable feasibility and performance while maintaining LVS/DRC standards.

8+ years of analog/mixed-signal layout experience is expected; a degree in EE/CE/CS or equivalent is preferred.

Qualifications

• Hands-on analog/mixed-signal layout experience.
• Experience with Cadence VLE/VXL and Calibre DRC/LVS.
• Solid understanding of layout impacts: speed, power, area.
• 8+ years of analog/mixed-signal layout experience.
• Degree in EE/CS/CE or equivalent.

Responsibilities

• Design layouts for critical analog and mixed-signal blocks.
• Drive exploratory layout process for next-generation architectures, including floorplanning, placement, and routing.
• Integrate full chip designs and perform LVS/DRC checks and documentation.
• Collaborate across domains to ensure architecture exploration.

Skills

Analog layout

Mixed-signal layout

DRAM layout

Collaboration

Problem solving

Education

Bachelor/Master in EE/CS/CE

Tools

Cadence VLE/VXL

Mentor Calibre DRC/LVS

Job description

Micron Technology in Richardson, TX seeks a Principal Layout Designer in the Next-generation HBM Architecture Team to drive analog and mixed-signal layouts for 3D-stacked memory designs. You will collaborate with architecture, design, and packaging teams to enable feasibility and performance while maintaining LVS/DRC standards.

8+ years of analog/mixed-signal layout experience is expected; a degree in EE/CE/CS or equivalent is preferred.