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Micron Technology, Inc. is seeking a Principal Layout Designer for next‑generation HBM architecture.
You will drive analog and mixed‑signal layout for 3D‑stacked memories, collaborating with architecture, design and packaging teams to prove feasibility and identify optimizations. Responsibilities include layout for critical blocks, floorplanning, placement and routing, LVS/DRC verification, and thorough documentation.
As a Principal Layout Designer in Micron’s High Bandwidth Memory Architecture organization, you will drive layout for 3D‑stacked, high‑performance memories. You will apply your knowledge to deliver high‑quality layout designs across analog and/or mixed‑signal domains in collaboration with peer architecture, design, and packaging teams, and implement layout designs for early architecture concepts to demonstrate feasibility and identify optimizations.
Layout/Mask Designer E4 – Layout/Mask Designer E5
TBD
US base salary range: $62.25 – $122.00 an hour. Additional compensation may include benefits, bonuses and equity. The paid time‑off program, paid holidays, and various benefit plans (medical, dental, vision, income protection, family leave) are provided. Compensation details reflect the base salary only and do not include bonus, equity, or benefits.
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.