Lead Hermetic Package Design Engineer

Renesas Electronics

Tempe (AZ)

On-site

USD 120,000 - 180,000

Full time

14 days+
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Job summary

Renesas Electronics is seeking a senior packaging engineer to drive hermetic, ceramic, metal, and Class P plastic packaging technologies for space, aerospace and defense applications. You will collaborate with design teams, OSAT partners, and internal manufacturing to define requirements, qualification plans, and process specifications.

The role emphasizes technical leadership, DOE activities, roadmaps, and ensuring manufacturability, reliability, and project schedules across global teams.

Qualifications

  • 10+ years of semiconductor package development experience, focusing on hermetic, ceramic, metal, radiation-tolerant or Class P plastic packaging.
  • Experience with IC assembly processes, materials, package technologies, and package qualification.
  • Familiarity with high-reliability, aerospace, space, or defense packaging requirements.
  • Experience working with external package suppliers, OSAT partners, or internal assembly/manufacturing sites.

Responsibilities

  • Develop hermetic, ceramic, metal, radiation-tolerant, and Class P plastic package technologies and interconnect methods for space, aerospace, and high-reliability power applications.
  • Define package technology requirements, tooling needs, process flows, and qualification plans for new and existing package platforms.
  • Benchmark, select, and qualify materials, assembly processes, and subcontractors, including OSAT partners and in-house Palm Bay assembly site.
  • Partner with product design teams to develop detailed package drawings for hermetic and plastic packages using AutoCAD.
  • Work with OSAT partners and internal manufacturing teams to run DOE activities, optimize assembly processes, and establish process specifications.
  • Collaborate with product engineering, program management, and reliability teams to qualify new packages and processes within required schedules.

Skills

Package development
AutoCAD
Cross-functional teamwork
Analytical thinking

Education

Bachelor's/Master's/PhD in Physics|Chemistry|Mechanical Engineering|Electrical Engineering|Materials Engineering

Tools

AutoCAD
Microsoft Office

Job description

Renesas Electronics is seeking a senior packaging engineer to drive hermetic, ceramic, metal, and Class P plastic packaging technologies for space, aerospace and defense applications. You will collaborate with design teams, OSAT partners, and internal manufacturing to define requirements, qualification plans, and process specifications.

The role emphasizes technical leadership, DOE activities, roadmaps, and ensuring manufacturability, reliability, and project schedules across global teams.

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