Senior Semiconductor Packaging Engineer

Renesas Electronics Corporation

Austin (TX)

On-site

USD 120,000 - 180,000

Full time

14 days+

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Job summary

Renesas Electronics Corporation seeks a Package Development Engineer to develop, qualify, and industrialize semiconductor package solutions for performance, reliability, cost, and schedule requirements. You will collaborate with silicon design, package design, manufacturing, reliability, and OSAT partners to bring new package technologies from concept to high-volume production.

The ideal candidate combines packaging expertise with hands-on problem-solving and the ability to drive technology

Qualifications

Bachelor's degree in a technical discipline as listed.
5+ years of semiconductor package development experience.
Strong knowledge of semiconductor assembly processes (backgrind, dicing, die attach, flip-chip, wire bonding, underfill, encapsulation, molding, ball attach, SMT).
Experience with OSAT collaboration for package qualification.
Knowledge of DOE, statistics, and structured problem-solving methodologies.
Experience conducting package reliability testing, failure analysis, and root-cause investigations.
Strong analytical, project management, and communication skills.
Ability to work independently within cross-functional global teams.

Responsibilities

Develop, qualify, and industrialize semiconductor package solutions.
Collaborate with silicon design, package design, manufacturing, reliability, quality, and OSAT partners.
Drive complex technology development activities from concept through high-volume manufacturing.
Lead DOE and statistical analyses to inform design and process decisions.
Work with cross-functional global teams to ensure project success.