Lead, Advanced Package Design Engineer (Hybrid)

Renesas Electronics Corporation

Austin (TX)

Hybrid

USD 140,000 - 200,000

Full time

14 days+

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Job summary

Renesas Electronics Corporation is seeking a Principal Package Design Engineer to lead development and integration of next-generation packaging solutions for high-performance semiconductors. The role emphasizes advanced package architecture, simulation, OSAT strategy, cross-functional collaboration, and qualification from concept to high-volume production.

The ideal candidate has extensive experience in semiconductor packaging, strong CAD/simulation skills, and a track record of delivering

Qualifications

MSc or PhD in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or a related field.
5+ years of experience in advanced semiconductor packaging or advanced electronics packaging and system integration.
Strong hands-on knowledge of advanced packaging technologies, materials, assembly processes, and application system integration as they apply to AI infrastructure and data center power management.
Deep understanding of thermal, mechanical, and electrical interactions in package design and extensive, hands-on model setup, simulations, and analysis.

Responsibilities

Lead the design, development, and qualification of advanced semiconductor packaging solutions including flip-chip, WLP/FOWLP, panel-level packaging, 2.5D/3D packaging, SiP, BGA/CSP, and heterogeneous bonding.
Define package architecture based on electrical, thermal, mechanical, reliability, and cost requirements with deep simulation expertise.
Drive package technology strategy and OSAT selection for new product introductions (NPI).
Collaborate with IC design, substrates, board, thermal, reliability, applications, and manufacturing teams to ensure package compatibility and performance.