Lead FAOK Wafer Bonding Equipment Engineer

Micron Technology; Boise (ID); Presencial; USD 110.000 - 170.000; Jornada completa

Ventajas ofrecidas por este puesto de trabajo

Medical plan

Dental plan

Vision plan

Paid time off

Paid holidays

Descripción de la vacante

Micron Technology in Boise, ID is seeking an Equipment Development Engineer specializing in wafer bonding to drive next‑generation FAOK equipment from concept to manufacturing. You’ll own critical challenges, work with suppliers, and advance precision alignment, overlay, bonding, and automation to push tool capability.

The role demands a hands‑on engineering mindset, strong data analytics, and collaboration across process development, manufacturing, and suppliers to define equipment roadmaps and

Formación

• Bachelor’s degree in Mechanical Engineering, Robotics, Mechatronics, Controls Engineering, Materials Science, Physics, or a related field, with 4+ years of semiconductor equipment experience.
• Ability to troubleshoot complex equipment, analyze data, and drive technical projects to completion.
• Experience with precision alignment, overlay, modeling, or complex electromechanical systems is valued.

Responsabilidades

• Own equipment-development challenges from concept through manufacturing implementation.
• Develop new equipment and subsystems with suppliers, evaluate new technologies, qualify hardware, and improve tool capability.
• Lead FAOK equipment development with suppliers.
• Drive improvements in overlay, alignment, bond‑wave behavior, tool matching, defectivity, contamination control, and equipment stability.
• Develop equipment requirements, performance budgets, experiments, simulations, and data‑driven solutions.
• Use modeling, automation, equipment data, and advanced analytics to understand system behavior and find opportunities others may not see.
• Lead equipment evaluations, installations, qualifications, upgrades, and major technical improvements.
• Help define our wafer bonding equipment and technology roadmap.
• Present technical recommendations and development strategies to engineering teams, suppliers, and leadership.
• Share your expertise, mentor other engineers, and help us build a world‑class wafer bonding engineering team.
• Demonstrate AI proficiency and utilize AI‑enabled workflows and tools for equipment monitoring, troubleshooting, data analysis, and technical problem solving to improve system performance and engineering productivity.

Conocimientos

4+ years semiconductor equipment

Python

MATLAB

Educación

Bachelor’s degree in Mechanical Engineering, Robotics, Mechatronics, Controls Engineering, Materials Science, Physics

Herramientas

Python

MATLAB

Descripción del empleo

Micron Technology in Boise, ID is seeking an Equipment Development Engineer specializing in wafer bonding to drive next‑generation FAOK equipment from concept to manufacturing. You’ll own critical challenges, work with suppliers, and advance precision alignment, overlay, bonding, and automation to push tool capability.

The role demands a hands‑on engineering mindset, strong data analytics, and collaboration across process development, manufacturing, and suppliers to define equipment roadmaps and