Equipment Development Engineer – Wafer Bonding - Technology Development Group

1000 Micron Technology, Inc.; Boise (ID); On-site; USD 110,000 - 150,000; Full time

Benefits offered by this job

Medical, dental, and vision plans

Paid time off

Paid holidays

Job summary

Micron Technology, Inc. is seeking an Equipment Development Engineer for Wafer Bonding in Boise, Idaho. The role focuses on developing next‑generation FAOK wafer bonding equipment, collaborating with suppliers, and delivering hardware solutions from concept to manufacturing.

You will own equipment performance, drive improvements in overlay and alignment, and contribute to the equipment roadmap. Travel is anticipated 5–10% for supplier development and cross‑site collaboration.

Qualifications

• Bachelor’s degree in Mechanical Engineering, Robotics, Mechatronics, Controls Engineering, Materials Science, Physics, or related field.
• 4+ years of semiconductor equipment, process, manufacturing, or related engineering experience.
• Experience with precision alignment, overlay, modeling, or complex electromechanical systems.

Responsibilities

• Own wafer bonding equipment performance, capability, reliability, availability, and productivity.
• Lead FAOK equipment, hardware, and subsystem development with our suppliers.
• Drive improvements in overlay, alignment, bond‑wave behavior, tool matching, defectivity, contamination control, and equipment stability.
• Develop equipment requirements, performance budgets, experiments, simulations, and data‑driven solutions.
• Use modeling, automation, equipment data, and advanced analytics to understand system behavior and find opportunities others may not see.
• Lead equipment evaluations, installations, qualifications, upgrades, and major technical improvements.
• Help define our wafer bonding equipment and technology roadmap.
• Present technical recommendations and development strategies to engineering teams, suppliers, and leadership.
• Share your expertise, mentor other engineers, and help us build a world‑class wafer bonding engineering team.
• Demonstrate AI proficiency and utilize AI‑enabled workflow and tools for equipment monitoring, troubleshooting, data analysis, and technical problem solving to improve system performance and engineering productivity.

Skills

Wafer bonding

Precision alignment

Overlay

Automation

Data analysis

Equipment development

Education

Bachelor’s degree in Mechanical Engineering, Robotics, Mechatronics, Controls Engineering, Materials Science, Physics, or related field

Tools

Python

MATLAB

SECS/GEM

FEA

DOE

Automation systems

Job description

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Equipment Development Engineer – Wafer Bonding

We’re looking for an engineer who wants to build what comes next! As an Equipment Development Engineer on Micron’s Wafer Bonding Equipment Development team, you’ll help develop next‑generation, first‑of‑a‑kind (FAOK) wafer bonding equipment. We take new ideas from concept to hardware, work directly with equipment suppliers to push system capability, and ultimately put those solutions into technology development and manufacturing. This is a hands‑on development role with significant technical ownership. You’ll work on precision alignment, overlay, bonding, controls, mechanical systems, automation, equipment data, and new hardware. When today’s equipment can’t meet tomorrow’s requirements, we figure out why and develop a solution! You’ll work closely with process development, manufacturing, suppliers, and engineering teams across Micron. Together, we’ll solve difficult equipment problems, develop new capabilities, and define the equipment roadmap required for future generations of Micron technology.

What You’ll Do

… You’ll own important equipment‑development challenges from initial concept through manufacturing implementation. That includes developing new equipment and subsystems with suppliers, evaluating new technologies, qualifying hardware, solving difficult equipment problems, and continuously improving tool capability. You will also:

• Own wafer bonding equipment performance, capability, reliability, availability, and productivity
• Lead FAOK equipment, hardware, and subsystem development with our suppliers
• Drive improvements in overlay, alignment, bond‑wave behavior, tool matching, defectivity, contamination control, and equipment stability
• Develop equipment requirements, performance budgets, experiments, simulations, and data‑driven solutions
• Use modeling, automation, equipment data, and advanced analytics to understand system behavior and find opportunities others may not see
• Lead equipment evaluations, installations, qualifications, upgrades, and major technical improvements
• Help define our wafer bonding equipment and technology roadmap
• Present technical recommendations and development strategies to engineering teams, suppliers, and leadership
• Share your expertise, mentor other engineers, and help us build a world‑class wafer bonding engineering team
• Demonstrate AI proficiency and utilize AI‑enabled workflow and tools for equipment monitoring, troubleshooting, data analysis, and technical problem solving to improve system performance and engineering productivity

What We’re Looking For

We’re looking for engineers who enjoy difficult technical problems and want responsibility for solving them. You should have a bachelor’s degree in Mechanical Engineering, Robotics, Mechatronics, Controls Engineering, Materials Science, Physics, or a related technical field, along with 4+ years of semiconductor equipment, process, manufacturing, or related engineering experience. You should be comfortable troubleshooting complex equipment, analyzing data, working across engineering disciplines, and driving technical projects to completion. Experience with precision alignment, overlay, modeling, or complex electromechanical systems is highly valued. Even Better If You Bring Experience with wafer‑to‑wafer fusion or hybrid bonding; precision alignment and overlay; motion control; semiconductor equipment development; Python or MATLAB; equipment data and SECS/GEM; sensors and automation; FEA, DOE, PCA, or other modeling techniques; or direct development work with semiconductor equipment suppliers. An MS or PhD and experience leading technical programs across multiple organizations, suppliers, or sites are also valuable. Most importantly, we’re looking for someone who wants to take ownership, challenge existing equipment limitations, and help us invent better solutions.

Travel

Approximately 5–10% domestic and international travel may be required for supplier development and cross‑site engineering collaboration.

Benefits

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time‑off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Equal Opportunity Employer

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.