Senior Wafer Bonding Process Engineer - DRAM and AI-Driven
Micron
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Benefits offered by this job
Job summary
Micron Technology is seeking a Staff/Principal Wafer Bonding Process Engineer in Boise, Idaho, to develop and optimize wafer bonding processes for next-generation DRAM technologies. You will lead DOE studies, drive yield and cost improvements, and collaborate across manufacturing and suppliers to implement robust process solutions.
Ideal candidates have advanced degree and extensive experience in bonding technologies, data analytics, and innovative problem solving.
Qualifications
- PhD with 3+ years, MS with 5+ years, or BS with 7+ years semiconductor experience.
- 5+ years developing and driving wafer bonding technologies or related processes.
- Hands-on experience with direct bonding, hybrid bonding, or related bonding tech.
Responsibilities
- Develop and optimize wafer bonding processes for next-generation DRAM.
- Plan and execute DOEs to improve process performance and reliability.
- Drive yield improvement, cost reduction, and productivity through data-driven problem solving.
- Evaluate and qualify new equipment, materials, and process technologies for development and manufacturing.
- Collaborate with manufacturing, suppliers, and cross-functional teams to implement improvements.
- Use AI/ML tools to solve complex problems and accelerate innovation.
Skills
Education
Tools
Job description
Micron Technology is seeking a Staff/Principal Wafer Bonding Process Engineer in Boise, Idaho, to develop and optimize wafer bonding processes for next-generation DRAM technologies. You will lead DOE studies, drive yield and cost improvements, and collaborate across manufacturing and suppliers to implement robust process solutions.
Ideal candidates have advanced degree and extensive experience in bonding technologies, data analytics, and innovative problem solving.
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