AI-Driven Wafer Bonding Equipment Engineer

Micron Technology, Inc.; Boise (ID); On-site; USD 110,000 - 150,000; Full time

Benefits offered by this job

Medical, dental, and vision plans

Paid time off

Paid holidays

Job summary

Micron Technology, Inc. is seeking an Equipment Development Engineer for Wafer Bonding in Boise, Idaho. The role focuses on developing next‑generation FAOK wafer bonding equipment, collaborating with suppliers, and delivering hardware solutions from concept to manufacturing.

You will own equipment performance, drive improvements in overlay and alignment, and contribute to the equipment roadmap. Travel is anticipated 5–10% for supplier development and cross‑site collaboration.

Qualifications

• Bachelor’s degree in Mechanical Engineering, Robotics, Mechatronics, Controls Engineering, Materials Science, Physics, or related field.
• 4+ years of semiconductor equipment, process, manufacturing, or related engineering experience.
• Experience with precision alignment, overlay, modeling, or complex electromechanical systems.

Responsibilities

• Own wafer bonding equipment performance, capability, reliability, availability, and productivity.
• Lead FAOK equipment, hardware, and subsystem development with our suppliers.
• Drive improvements in overlay, alignment, bond‑wave behavior, tool matching, defectivity, contamination control, and equipment stability.
• Develop equipment requirements, performance budgets, experiments, simulations, and data‑driven solutions.
• Use modeling, automation, equipment data, and advanced analytics to understand system behavior and find opportunities others may not see.
• Lead equipment evaluations, installations, qualifications, upgrades, and major technical improvements.
• Help define our wafer bonding equipment and technology roadmap.
• Present technical recommendations and development strategies to engineering teams, suppliers, and leadership.
• Share your expertise, mentor other engineers, and help us build a world‑class wafer bonding engineering team.
• Demonstrate AI proficiency and utilize AI‑enabled workflow and tools for equipment monitoring, troubleshooting, data analysis, and technical problem solving to improve system performance and engineering productivity.

Skills

Wafer bonding

Precision alignment

Overlay

Automation

Data analysis

Equipment development

Education

Bachelor’s degree in Mechanical Engineering, Robotics, Mechatronics, Controls Engineering, Materials Science, Physics, or related field

Tools

Python

MATLAB

SECS/GEM

FEA

DOE

Automation systems

Job description

Micron Technology, Inc. is seeking an Equipment Development Engineer for Wafer Bonding in Boise, Idaho. The role focuses on developing next‑generation FAOK wafer bonding equipment, collaborating with suppliers, and delivering hardware solutions from concept to manufacturing.

You will own equipment performance, drive improvements in overlay and alignment, and contribute to the equipment roadmap. Travel is anticipated 5–10% for supplier development and cross‑site collaboration.