Bonding Process Engineer – Advanced Packaging

Micron Technology; Boise (ID); On-site; USD 85,000 - 120,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time off

Paid holidays & family leave

Job summary

Micron Technology in Boise, Idaho is seeking a Process Engineer to join the Advanced Packaging Technology Development (APTD) Bonding team. You will start up, develop, and optimize processes to improve product quality and reliability on packaging lines.

The role emphasizes yield, productivity, cost reduction, and risk management, with problem solving through DOE, SPC, and root-cause analysis, and collaboration with global R&D and manufacturing teams.

Qualifications

• BS in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, or Physics + 5 years of relevant industry experience.
• Knowledge of Advanced Package Integration and DRAM, NAND, or other memory products.
• Experience with DOE techniques, SPC, defect analysis and data analysis.
• Experience in semiconductor process engineering and packaging with understanding of process/equipment interactions.
• Ability to resolve sophisticated issues through root-cause or model-based problem solving.

Responsibilities

• Develop new or modified process formulations, define equipment requirements and specifications, and review processing techniques and methods.
• Identify, diagnose, and resolve assembly process related problems.
• Coordinate and complete process, equipment, and material evaluation/optimization initiatives and implement changes at process step.
• Validate and fan out new process baseline qualified for new product introduction.
• Support SPC/FDC/RMS/APC and site-to-site portability.
• Audit material suppliers to achieve quality, cost and risk management objectives.

Skills

Process engineering

DOE techniques

SPC

Root-cause analysis

Packaging knowledge

Education

BS in Materials Science or related field

Tools

FMEA

8D problem solving

Statistical analysis

Job description

Micron Technology in Boise, Idaho is seeking a Process Engineer to join the Advanced Packaging Technology Development (APTD) Bonding team. You will start up, develop, and optimize processes to improve product quality and reliability on packaging lines.

The role emphasizes yield, productivity, cost reduction, and risk management, with problem solving through DOE, SPC, and root-cause analysis, and collaboration with global R&D and manufacturing teams.