Senior CMP/Bond Equipment Engineer — Lead & Innovate

Micron Technology, Inc.; Boise (ID); Hybrid; USD 110,000 - 160,000; Full time

Job summary

Micron Technology, Inc. in Boise, Idaho is seeking a Sr. Engineer to advance CMP/Bond equipment development.

You will install, start-up, and refine cutting-edge semiconductor processing equipment, collaborating with process engineering and external vendors to achieve leadership in memory production. You will mentor junior engineers, drive large, technically complex projects, and apply DOE, defect analysis, and data-driven methods to optimize scrap, yield, cycle time, and fab metrics.

Qualifications

• Bachelor's degree in Engineering Technology, Electrical, Materials or related field.
• 2 years of CMP/Bond equipment development experience.
• Experience with DOE methods, defect analysis and data analysis.
• Analytical skills and problem-solving using model-based approaches.

Responsibilities

• Install, start-up and improve CMP/Bond hardware and processes.
• Lead module-level development and large technical projects.
• Collaborate with process engineering and external vendors.
• Analyze results and implement improvements to fab metrics (yield, scrap, cycle time).
• Mentor new engineers and share knowledge across teams.

Skills

DOE techniques

Data analysis

Problem solving

JMP Pro 18

Education

Bachelor's degree

Tools

JMP Pro 18

EMA

SPACE

E3 software

Job description

Micron Technology, Inc. in Boise, Idaho is seeking a Sr. Engineer to advance CMP/Bond equipment development.

You will install, start-up, and refine cutting-edge semiconductor processing equipment, collaborating with process engineering and external vendors to achieve leadership in memory production. You will mentor junior engineers, drive large, technically complex projects, and apply DOE, defect analysis, and data-driven methods to optimize scrap, yield, cycle time, and fab metrics.