Equipment Development Engineer – Wafer Bonding - Technology Development Group

Micron Technology; Boise (ID); Presencial; USD 110.000 - 170.000; Jornada completa

Ventajas ofrecidas por este puesto de trabajo

Medical plan

Dental plan

Vision plan

Paid time off

Paid holidays

Descripción de la vacante

Micron Technology in Boise, ID is seeking an Equipment Development Engineer specializing in wafer bonding to drive next‑generation FAOK equipment from concept to manufacturing. You’ll own critical challenges, work with suppliers, and advance precision alignment, overlay, bonding, and automation to push tool capability.

The role demands a hands‑on engineering mindset, strong data analytics, and collaboration across process development, manufacturing, and suppliers to define equipment roadmaps and

Formación

• Bachelor’s degree in Mechanical Engineering, Robotics, Mechatronics, Controls Engineering, Materials Science, Physics, or a related field, with 4+ years of semiconductor equipment experience.
• Ability to troubleshoot complex equipment, analyze data, and drive technical projects to completion.
• Experience with precision alignment, overlay, modeling, or complex electromechanical systems is valued.

Responsabilidades

• Own equipment-development challenges from concept through manufacturing implementation.
• Develop new equipment and subsystems with suppliers, evaluate new technologies, qualify hardware, and improve tool capability.
• Lead FAOK equipment development with suppliers.
• Drive improvements in overlay, alignment, bond‑wave behavior, tool matching, defectivity, contamination control, and equipment stability.
• Develop equipment requirements, performance budgets, experiments, simulations, and data‑driven solutions.
• Use modeling, automation, equipment data, and advanced analytics to understand system behavior and find opportunities others may not see.
• Lead equipment evaluations, installations, qualifications, upgrades, and major technical improvements.
• Help define our wafer bonding equipment and technology roadmap.
• Present technical recommendations and development strategies to engineering teams, suppliers, and leadership.
• Share your expertise, mentor other engineers, and help us build a world‑class wafer bonding engineering team.
• Demonstrate AI proficiency and utilize AI‑enabled workflows and tools for equipment monitoring, troubleshooting, data analysis, and technical problem solving to improve system performance and engineering productivity.

Conocimientos

4+ years semiconductor equipment

Python

MATLAB

Educación

Bachelor’s degree in Mechanical Engineering, Robotics, Mechatronics, Controls Engineering, Materials Science, Physics

Herramientas

Python

MATLAB

Descripción del empleo

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Equipment Development Engineer – Wafer Bonding

We’re looking for an engineer who wants to build what comes next!

As an Equipment Development Engineer on Micron’s Wafer Bonding Equipment Development team, you’ll help develop next-generation, first-of-a-kind (FAOK) wafer bonding equipment. We take new ideas from concept to hardware, work directly with equipment suppliers to push system capability, and ultimately put those solutions into technology development and manufacturing.

This is a hands‑on development role with significant technical ownership. You’ll work on precision alignment, overlay, bonding, controls, mechanical systems, automation, equipment data, and new hardware. When today’s equipment can’t meet tomorrow’s requirements, we figure out why and develop a solution!

You’ll work closely with process development, manufacturing, suppliers, and engineering teams across Micron. Together, we’ll solve difficult equipment problems, develop new capabilities, and define the equipment roadmap required for future generations of Micron technology.

What You’ll Do

You’ll own important equipment‑development challenges from initial concept through manufacturing implementation. That includes developing new equipment and subsystems with suppliers, evaluating new technologies, qualifying hardware, solving difficult equipment problems, and continuously improving tool capability.

You Will Also

• Own wafer bonding equipment performance, capability, reliability, availability, and productivity
• Lead FAOK equipment, hardware, and subsystem development with our suppliers
• Drive improvements in overlay, alignment, bond‑wave behavior, tool matching, defectivity, contamination control, and equipment stability
• Develop equipment requirements, performance budgets, experiments, simulations, and data‑driven solutions
• Use modeling, automation, equipment data, and advanced analytics to understand system behavior and find opportunities others may not see
• Lead equipment evaluations, installations, qualifications, upgrades, and major technical improvements
• Help define our wafer bonding equipment and technology roadmap
• Present technical recommendations and development strategies to engineering teams, suppliers, and leadership
• Share your expertise, mentor other engineers, and help us build a world‑class wafer bonding engineering team
• Demonstrate AI proficiency and utilize AI‑enabled workflows and tools for equipment monitoring, troubleshooting, data analysis, and technical problem solving to improve system performance and engineering productivity.

What We’re Looking For

We’re looking for engineers who enjoy difficult technical problems and want responsibility for solving them.

You should have a bachelor’s degree in Mechanical Engineering, Robotics, Mechatronics, Controls Engineering, Materials Science, Physics, or a related technical field, along with 4+ years of semiconductor equipment, process, manufacturing, or related engineering experience.

You should be comfortable troubleshooting complex equipment, analyzing data, working across engineering disciplines, and driving technical projects to completion. Experience with precision alignment, overlay, modeling, or complex electromechanical systems is highly valued.

Even Better If You Bring

Experience with wafer‑to‑wafer fusion or hybrid bonding; precision alignment and overlay; motion control; semiconductor equipment development; Python or MATLAB; equipment data and SECS/GEM; sensors and automation; FEA, DOE, PCA, or other modeling techniques; or direct development work with semiconductor equipment suppliers.

An MS or PhD and experience leading technical programs across multiple organizations, suppliers, or sites are also valuable.

Most importantly, we’re looking for someone who wants to take ownership, challenge existing equipment limitations, and help us invent better solutions.

Travel

Approximately 5–10% domestic and international travel may be required for supplier development and cross‑site engineering collaboration.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time‑off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at [e-mail] or 1-800-336-8918 (select option #3)

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.