Lead AI-Driven ASIC Packaging Automation Engineer

Advanced Micro Devices; Santa Clara (CA); Hybrid; USD 140,000 - 190,000; Full time

Benefits offered by this job

Hybrid work model

AMD benefits at a glance

Job summary

Advanced Micro Devices (AMD) is seeking a seasoned engineer to support the package design organization, developing and deploying AI-driven automation workflows for advanced packaging—substrates, silicon interposers, and bridge-based integration.

You will apply AI/ML to design activities, collaborate across Design, EDA, and AI/ML teams, and drive automation to improve efficiency, quality, and cycle time in a fast-paced, technically demanding environment.

Qualifications

• Experience in semiconductor packaging or SOC physical design automation.
• Strong knowledge of EDA packaging tools and design flows.
• Familiarity with DRC/LVS and parasitic extraction.

Responsibilities

• Develop, deploy, and maintain automation frameworks and AI-assisted workflows for packaging.
• Apply AI/ML to auto-routing, placement optimization, and design verification.
• Collaborate with package design, SI/PI, and EDA tool teams to enable next-gen packaging design.
• Develop tools for design flow integration, data extraction, and closed-loop optimization with simulation teams.
• Support tape-outs and ensure automation readiness and quality.
• Document best practices and reusable workflows.

Skills

Automation

Python scripting

Cross-functional collaboration

Problem solving

Communication

Education

Bachelor's or higher in Electrical Engineering, Computer Engineering, CS

Tools

Cadence APD/SiP

Siemens Xpedition

Synopsys 3DICC

Job description

Advanced Micro Devices (AMD) is seeking a seasoned engineer to support the package design organization, developing and deploying AI-driven automation workflows for advanced packaging—substrates, silicon interposers, and bridge-based integration.

You will apply AI/ML to design activities, collaborate across Design, EDA, and AI/ML teams, and drive automation to improve efficiency, quality, and cycle time in a fast-paced, technically demanding environment.