Mechanical Engineer

AMD; San Jose (CA); On-site; USD 110,000 - 170,000; Full time

Job summary

AMD in California is seeking a hands-on Mechanical Engineer with semiconductor packaging experience to drive advanced packaging designs for AI, HPC, ASIC, and SoC products. You will model, analyze, and optimize mechanical solutions from concept through production, ensuring reliability and manufacturability.

You will collaborate with packaging architects, suppliers, and contract manufacturers, performing CAD work in Creo, carrying out GD&T and tolerance analyses, and applying thermo-mechanical

Qualifications

• MS or PhD in Mechanical Engineering or related field.
• Semiconductor packaging experience with ASIC/SoC/CPU/GPU/HPC.
• Proficient CAD modeling and GD&T; able to perform tolerance analysis.
• Experience with thermo-mechanical modeling using ANSYS Mechanical.
• Ability to work with suppliers and contract manufacturers.

Responsibilities

• Develop advanced semiconductor packaging solutions for AI/HPC/SoC products.
• Lead CAD modeling, tolerance analysis, DFM reviews, and design changes.
• Collaborate with suppliers and manufacturing partners to ensure manufacturability.
• Conduct thermo-mechanical analyses and assist package integration.
• Support chip-package-board-system level integration across teams.

Skills

Semiconductor packaging

CAD modeling

GD&T

Thermo-mechanical modeling

Supplier collaboration

Design reviews

Education

MS or PhD in Mechanical Engineering

Tools

Creo

ANSYS Mechanical

Job description

ADVANCE YOUR CAREER. ADVANCE THE WORLD.

At AMD, we believetechnology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMDis shapingthefuture.

Whetheryou’redesigning next-gen processors, enabling AI breakthroughs, orbringing leading edge products to market, every role at AMD contributes to something bigger— technologythat moves the world forward.Join us and, together, we’ll advance your career.

THE ROLE:

AMD's Advanced Packaging team is developing next-generation packaging and cooling solutions that enable industry-leading AI, HPC, FPGA, ASIC, and SoC products. In this role, you will work closely with packaging architects, suppliers, and manufacturing partners to develop mechanical solutions for advanced semiconductor packages, helping drive designs from concept through production.

This is a highly collaborative position with strong exposure to advanced packaging technologies, supplier engagement, manufacturability, and future platform development.

THE PERSON:

You are a hands-on mechanical engineer with semiconductor packaging experience and a strong foundation in mechanical design, modeling, and product development. You enjoy working with suppliers, reviewing designs, solving technical challenges, and helping bring new technologies into production.

You thrive in a cross-functional environment and can effectively balance technical execution, manufacturability, and product requirements.

KEY RESPONSIBILITIES:

• Support development of advanced semiconductor packaging solutions for AI, HPC, FPGA, ASIC, and SoC products.
• Drive mechanical design activities including CAD modeling, tolerance analysis, fit checks, and DFM reviews.
• Collaborate with suppliers and contract manufacturers to develop manufacturable packaging solutions and define design requirements.
• Review and evaluate mechanical designs, simulations, drawings, and engineering changes to ensure product quality and manufacturability.
• Support thermo-mechanical modeling and package integration activities using tools such as Creo and ANSYS Mechanical.
• Contribute to chip, package, board, and system-level integration efforts.
• Partner with packaging, thermal, reliability, manufacturing, and supply-chain teams throughout product development and ramp.
• Support development of next-generation packaging, cooling, and materials technologies for future AMD products.

REQUIRED QUALIFICATIONS:

• Semiconductor packaging experience supporting ASIC, SoC, FPGA, CPU, GPU, AI, or HPC products.
• Experience with mechanical design, CAD modeling, GD&T, tolerance analysis, DFM, and design reviews.
• Familiarity with thermo-mechanical modeling using ANSYS Mechanical or similar tools.
• Understanding of chip-package interaction, package-board interaction, and semiconductor package integration.
• Experience working with suppliers, contract manufacturers, or packaging development partners.
• Knowledge of advanced packaging technologies and manufacturing processes.
• Experience with advanced cooling solutions, thermal technologies, or emerging packaging materials is a plus.

ACADEMIC CREDENTIALS:

• MS or PhD in Mechanical Engineering, Materials Engineering, Electrical Engineering, Applied Mechanics, or related technical field. Equivalent industry experience may be considered.

This role is not eligible for visa sponsorship. #LI-DR2

Benefits offered are described: AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.

This posting is for an existing vacancy.