AI-Driven VLSI Packaging Design Engineer

NVIDIA; California (MO); On-site; USD 136,000 - 264,500; Full time

Benefits offered by this job

Equity

Benefits package

Job summary

NVIDIA’s Advanced Package Engineering team is expanding to build production‑grade EDA tooling for next‑generation AI and HPC packages. The role focuses on crafting flows for silicon and interposer design, improving automation, and enabling engineers with robust, maintainable tools.

You will work with skilled engineers to implement, test, and optimize package design workflows, leveraging Python/C++ and AI techniques to enhance design analysis and throughput. Equity and benefits are offered.

Qualifications

• BS in Computer Science, Electrical Engineering, or related field (or equivalent).
• 5+ years of flow/methodology development for package design at scale.
• Strong Python and/or C++ fundamentals with data structures and algorithms.
• Experience applying AI/ML in engineering workflows and EDA contexts.

Responsibilities

• Design and implement VLSI tools for silicon and substrate design with world‑class engineers.
• Develop applications to enable project engineers with maintainability and usability.
• Create flows/tools to construct, analyze, and validate package designs across production stages.
• Optimize daily workflows of top package designers.

Skills

Python

C++

Data structures

Algorithms

OO design

Code quality

AI/ML in workflows

Education

BS in CS or EE or related field

Job description

NVIDIA’s Advanced Package Engineering team is expanding to build production‑grade EDA tooling for next‑generation AI and HPC packages. The role focuses on crafting flows for silicon and interposer design, improving automation, and enabling engineers with robust, maintainable tools.

You will work with skilled engineers to implement, test, and optimize package design workflows, leveraging Python/C++ and AI techniques to enhance design analysis and throughput. Equity and benefits are offered.