Mechanical Engineer, Advanced Semiconductor Packaging

AMD; San Jose (CA); On-site; USD 110,000 - 170,000; Full time

Job summary

AMD in California is seeking a hands-on Mechanical Engineer with semiconductor packaging experience to drive advanced packaging designs for AI, HPC, ASIC, and SoC products. You will model, analyze, and optimize mechanical solutions from concept through production, ensuring reliability and manufacturability.

You will collaborate with packaging architects, suppliers, and contract manufacturers, performing CAD work in Creo, carrying out GD&T and tolerance analyses, and applying thermo-mechanical

Qualifications

• MS or PhD in Mechanical Engineering or related field.
• Semiconductor packaging experience with ASIC/SoC/CPU/GPU/HPC.
• Proficient CAD modeling and GD&T; able to perform tolerance analysis.
• Experience with thermo-mechanical modeling using ANSYS Mechanical.
• Ability to work with suppliers and contract manufacturers.

Responsibilities

• Develop advanced semiconductor packaging solutions for AI/HPC/SoC products.
• Lead CAD modeling, tolerance analysis, DFM reviews, and design changes.
• Collaborate with suppliers and manufacturing partners to ensure manufacturability.
• Conduct thermo-mechanical analyses and assist package integration.
• Support chip-package-board-system level integration across teams.

Skills

Semiconductor packaging

CAD modeling

GD&T

Thermo-mechanical modeling

Supplier collaboration

Design reviews

Education

MS or PhD in Mechanical Engineering

Tools

Creo

ANSYS Mechanical

Job description

AMD in California is seeking a hands-on Mechanical Engineer with semiconductor packaging experience to drive advanced packaging designs for AI, HPC, ASIC, and SoC products. You will model, analyze, and optimize mechanical solutions from concept through production, ensuring reliability and manufacturability.

You will collaborate with packaging architects, suppliers, and contract manufacturers, performing CAD work in Creo, carrying out GD&T and tolerance analyses, and applying thermo-mechanical