Principal Mechanical Engineer, Advanced Packaging Leader

Advanced Micro Devices; San Jose (CA); On-site; USD 160,000 - 220,000; Full time

Job summary

Advanced Micro Devices (AMD) is seeking a Principal Mechanical Engineer to lead the mechanical architecture of advanced semiconductor packaging solutions. You will drive concept definition, design, simulation, qualification, and ramp to production, working across silicon, packaging, thermal, reliability, and manufacturing teams.

The role requires deep hands-on experience with thermo-mechanical analysis and leadership in complex packaging programs.

Qualifications

• MS or PhD in Mechanical Engineering or related field.
• Experience leading advanced semiconductor packaging projects.
• Strong background in thermo-mechanical reliability and stress analysis.
• Proven ability to lead cross-functional teams from concept to production.
• Hands-on modeling, design reviews, and supplier engagement.

Responsibilities

• Lead mechanical architecture and design strategy for advanced packaging solutions.
• Drive mechanical design, CAD development, and thermo-mechanical analysis through production.
• Guide stress, warpage, reliability, and package-board interaction modeling (FEA).
• Collaborate with silicon, packaging, thermal, reliability, and manufacturing teams.
• Conduct qualification, failure analysis, and root-cause investigations across NPI and production.
• Establish design guidelines and manufacturing requirements for advanced packaging.

Skills

ANSYS Mechanical

Creo

SolidWorks

FEA

Thermo-mechanical

Stress analysis

Packaging

Leadership

Cross-functional

Education

MS in Mechanical Engineering

PhD in a related field

Tools

DIC

Shadow moiré

Job description

Advanced Micro Devices (AMD) is seeking a Principal Mechanical Engineer to lead the mechanical architecture of advanced semiconductor packaging solutions. You will drive concept definition, design, simulation, qualification, and ramp to production, working across silicon, packaging, thermal, reliability, and manufacturing teams.

The role requires deep hands-on experience with thermo-mechanical analysis and leadership in complex packaging programs.