Lead Advanced Package Integration Engineer

Advanced Micro Devices; Austin (TX); Hybrid; USD 150,000 - 190,000; Full time

Job summary

Advanced Micro Devices in Austin, TX seeks an experienced Advanced Package Integration Engineer to drive package process development for EPYC server products. You will own packaging planning, development, and qualification across internal teams and external suppliers.

The role requires leading global teams to design test vehicles, develop and qualify processes, and resolve technical and schedule challenges to meet milestones.

Qualifications

• Requires strong project management and problem-solving skills.
• Ability to present technical information to diverse audiences.
• Experience leading global, cross-functional teams in complex NPI programs.

Responsibilities

• Define test-vehicle and product-package designs with cross-functional teams.
• Lead technology development and product NPI across geographies and suppliers.
• Identify risks and implement mitigation plans for schedules and yield.
• Troubleshoot issues affecting schedule, yield, reliability, and process robustness.
• Collect, analyze, and present data to drive technical decisions.

Skills

Project management

Problem solving

Communication

Cross-functional collaboration

Leadership

Education

Engineering degree

Job description

Advanced Micro Devices in Austin, TX seeks an experienced Advanced Package Integration Engineer to drive package process development for EPYC server products. You will own packaging planning, development, and qualification across internal teams and external suppliers.

The role requires leading global teams to design test vehicles, develop and qualify processes, and resolve technical and schedule challenges to meet milestones.