Advanced Packaging Substrate Engineer

AMD; Austin (TX); Hybrid; USD 130,000 - 180,000; Full time

Job summary

AMD is seeking a role leading packaging technology development for supply chain bring up of advanced substrate technologies to support AMD's product roadmap. The ideal candidate will have a hands-on approach and excellent communication skills to collaborate with stakeholders and global teams.

Responsibilities include defining roadmaps across pitch scaling, power delivery, and cost vectors, partnering with architects and product owners to define high-yield substrate solutions, and qualifying

Qualifications

• Hands-on packaging technology experience.
• Strong communication to stakeholders and global teams.
• BS/MS/PhD in solid state physics, chemistry, materials science, chemical engineering or equivalent.

Responsibilities

• Define advanced substrate and board technology roadmap across pitch scaling, power delivery, signal integrity and cost vectors.
• Partner with AMD architects, designers, and product owners to define high yielding, cost effective substrate solutions meeting product requirements.
• Select development partners to bring into AMD supply chain to enable industry leading substrate and PCB technology.
• Partner with product, quality and manufacturing engineering teams to meet milestones for manufacturability, yield and reliability from concept through NPI.
• Qualify package substrates of new products meeting cost and yield targets.

Skills

Cross-functional leadership

Communication skills

Packaging knowledge

Board design rules

Education

BS/MS/PhD in relevant field

Job description

AMD is seeking a role leading packaging technology development for supply chain bring up of advanced substrate technologies to support AMD's product roadmap. The ideal candidate will have a hands-on approach and excellent communication skills to collaborate with stakeholders and global teams.

Responsibilities include defining roadmaps across pitch scaling, power delivery, and cost vectors, partnering with architects and product owners to define high-yield substrate solutions, and qualifying