Advanced Packaging Process Integration Engineer

1000 Micron Technology, Inc.; Boise (ID); On-site; USD 90,000 - 120,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time off

Paid holidays

Benefits and retirement programs

Job summary

Micron Technology, Inc. is hiring a Process Integration Engineer in Advanced Packaging Technology Development (APTD) to drive integration of next-generation packaging approaches.

You will contribute to process development, technology evaluation, and qualification in a highly collaborative R&D setting. Ideal candidates have a strong background in semiconductor packaging, data analysis, and problem-solving, with a passion for innovation and continuous learning in a fast-paced engineering

Qualifications

• Master's degree or equivalent experience in Electrical Engineering, Materials Science, Mechanical Engineering, Physics, Chemistry, or a related engineering/science field.
• Knowledge of semiconductor manufacturing, process integration, materials engineering, device physics, or advanced packaging through coursework, research, internships, or industry experience.
• Demonstrated analytical and problem-solving skills through academic research, internships, laboratory work, or engineering projects.
• Ability to work effectively in a collaborative, multi-functional team environment and communicate technical concepts clearly.
• Experience using data analysis tools and a willingness to learn AI-assisted technologies that improve engineering productivity and decision-making.

Responsibilities

• Support the development, characterization, and integration of breakthrough packaging and interconnect solutions for next-generation semiconductor products.
• Collaborate with multi-functional engineering teams to analyze process data, solve technical challenges, and improve technology performance.
• Participate in experiments, process evaluations, and technology qualification activities to support development objectives.
• Utilize AI-enabled and data-driven tools to analyze engineering results, identify trends, and support technical decision-making.
• Promote a culture of safety, quality, compliance, and continuous learning.

Skills

Analytical skills

Data analysis

Team collaboration

AI-enabled tooling

Education

Master's degree or equivalent in Electrical Engineering, Materials Science, Mechanical Engineering, Physics, Chemistry, or related field

Tools

DoE

Job description

Micron Technology, Inc. is hiring a Process Integration Engineer in Advanced Packaging Technology Development (APTD) to drive integration of next-generation packaging approaches.

You will contribute to process development, technology evaluation, and qualification in a highly collaborative R&D setting. Ideal candidates have a strong background in semiconductor packaging, data analysis, and problem-solving, with a passion for innovation and continuous learning in a fast-paced engineering