Senior Principal Mech Engineer - Advanced Packaging

CareerArc; San Jose (CA); On-site; USD 150,000 - 210,000; Full time

Job summary

AMD is seeking a Principal Mechanical Engineer to lead the mechanical architecture for advanced semiconductor packaging, spanning concept to production ramps. You will collaborate across silicon, packaging, thermal, and manufacturing teams to deliver industry‑leading packaging solutions.

The role demands hands‑on modeling, design reviews, supplier engagement, and mentorship of engineers through NPI, qualification, and ramp stages.

Qualifications

• Leadership experience in complex semiconductor packaging or high‑performance hardware projects.
• Strong capability in modeling, design reviews, and cross‑functional execution across silicon, packaging, thermal, reliability and manufacturing teams.
• Experience with advanced packaging architectures (flip‑chip, 2.5D/3D, interposer) and supplier engagement.

Responsibilities

• Lead mechanical architecture and design strategy for advanced semiconductor packaging solutions.
• Drive mechanical design, CAD development, and thermo‑mechanical analysis from concept through production.
• Guide stress, warpage, reliability, and package‑board interaction modeling with FEA tools.

Skills

Technical leadership

Cross-functional collaboration

Problem solving

Education

MS/PhD in Mechanical Engineering

Tools

ANSYS Mechanical

Creo

SolidWorks

FEA workflows

Job description

AMD is seeking a Principal Mechanical Engineer to lead the mechanical architecture for advanced semiconductor packaging, spanning concept to production ramps. You will collaborate across silicon, packaging, thermal, and manufacturing teams to deliver industry‑leading packaging solutions.

The role demands hands‑on modeling, design reviews, supplier engagement, and mentorship of engineers through NPI, qualification, and ramp stages.