IC Packaging Architect & Technology Lead

Advanced Micro Devices, Inc; Austin (TX); On-site; USD 120,000 - 160,000; Full time

Job summary

Advanced Micro Devices, Inc in Austin, Texas, is seeking a technology leader in advanced packaging to drive product architecture for client, server, gaming, and GPU products. The ideal candidate will have a robust background in semiconductor technology and experience leading engineering teams while ensuring effective communication across diverse stakeholders.

This role is pivotal in guiding technology developments, requiring expertise in yield improvement and packaging processes. The position offers a chance to collaborate globally and contribute significantly to the semiconductor industry's future.

Qualifications

• Proven track record of driving technology development in semiconductor field.
• Excellent leadership and communication skills.
• In-depth knowledge in packaging and material science.

Responsibilities

• Work with product architects to define package architectures and roadmap.
• Lead new package technology development initiatives to full qualification.
• Drive design and manufacturing to establish design rules and guidelines.
• Establish yield roadmap and implement analytics tools as needed.

Skills

Leadership experience in engineering teams

Excellent oral and written communication skills

Experience in semiconductor technology development

Knowledge in material science and thin film processes

Proven track record in yield improvement

Education

BS/MS/PhD in Material Science, Mechanical Engineering, Computer Science, Applied Mathematics, Electrical Engineering or equivalent

Job description

Advanced Micro Devices, Inc in Austin, Texas, is seeking a technology leader in advanced packaging to drive product architecture for client, server, gaming, and GPU products. The ideal candidate will have a robust background in semiconductor technology and experience leading engineering teams while ensuring effective communication across diverse stakeholders.

This role is pivotal in guiding technology developments, requiring expertise in yield improvement and packaging processes. The position offers a chance to collaborate globally and contribute significantly to the semiconductor industry's future.