Director, Advanced fcCSP Packaging & Product Management

MIcro-Precision Technologies; Tempe (AZ); Hybrid; USD 110,000 - 140,000; Full time

Job summary

MIcro-Precision Technologies is looking for a Product Manager for their Advanced Flip Chip Packaging Business Unit in Tempe, AZ. This role involves cross-functional management and direct customer interactions for product development and production.

The ideal candidate will have a Bachelor's degree in engineering and over 10 years of industry experience. Responsibilities include managing timelines, developing supplier relationships, and performing cost modeling. This position offers a hybrid work schedule and requires some travel.

Qualifications

• 10+ years of experience in the semiconductor industry.
• Organized technical Project Management experience.
• Ability to work independently in a matrixed organization.
• Deep knowledge of semiconductor packaging design.
• Excellent written and verbal communication skills.

Responsibilities

• Manage product development and customer interactions.
• Drive customer requirements and timelines.
• Perform detailed cost analysis for product pricing.
• Develop relationships with suppliers and factory engineers.
• Participate in negotiations for pricing and capacity.

Skills

Project Management

Customer Interaction

Communication Skills

Cost Modeling

Education

Bachelor's Degree in Engineering

Master's Degree in Engineering

Tools

Microsoft Office

Job description

MIcro-Precision Technologies is looking for a Product Manager for their Advanced Flip Chip Packaging Business Unit in Tempe, AZ. This role involves cross-functional management and direct customer interactions for product development and production.

The ideal candidate will have a Bachelor's degree in engineering and over 10 years of industry experience. Responsibilities include managing timelines, developing supplier relationships, and performing cost modeling. This position offers a hybrid work schedule and requires some travel.