Lead, 2.5D/3D Packaging Design & Customer Enablement

Rapidus Corporation US; Santa Clara (CA); On-site; USD 140,000 - 230,000; Full time

Benefits offered by this job

Health, Dental and Vision coverage

Job summary

Rapidus Corporation seeks a Customer Package Design Integration Engineer to drive the execution of chiplet-based product development using Rapidus advanced packaging technologies. You will serve as the primary technical and program interface between Rapidus and customers, integrating ADKs, packaging technologies, and customer design activities into a unified outcome.

You will combine deep expertise in 2.5D/3D packaging and chiplet integration with strong program management and cross-functional

Qualifications

• B.S. or M.S. in Electrical Engineering, Mechanical Engineering, Materials Science, or related field.
• 5+ years of experience in semiconductor packaging, system design, or customer-facing engineering roles.
• Strong understanding of 2.5D / 3D packaging (interposer, TSV, hybrid bonding, RDL/fan-out).
• High-speed interfaces (HBM, PCIe, UCIe, SerDes).
• Hands-on experience with package design and analysis tools (Cadence, Ansys, Synopsys, etc.)
• Proven ability to manage complex technical programs and cross-functional activities
• Strong communication skills with customer-facing experience

Responsibilities

• Guide customers in effectively applying package design rules, libraries, and interface definitions.
• Interposer and substrate architectures; provide technical guidance on chiplet integration including HBM, UCIe, PCIe, and high-speed SerDes.
• Drive customer projects toward successful 2.5D/3D package design tape-out and product realization.
• Manage design schedules and milestones, risks, issues, and dependencies, cross-functional action items.
• Lead regular technical and program reviews with customers and internal teams.
• Act as the central coordination point across customer engineering teams, ADK / Enablement teams, process, manufacturing, and OSAT partners.

Job description

Rapidus Corporation seeks a Customer Package Design Integration Engineer to drive the execution of chiplet-based product development using Rapidus advanced packaging technologies. You will serve as the primary technical and program interface between Rapidus and customers, integrating ADKs, packaging technologies, and customer design activities into a unified outcome.

You will combine deep expertise in 2.5D/3D packaging and chiplet integration with strong program management and cross-functional