Lead Packaging Architect: 2.5D/3D & Chiplet Systems

MediaTek

San Jose (CA)

On-site

USD 171,000 - 272,000

Full time

14 days+

Get more replies from employers

Send a job-specific resume in minutes.

Benefits offered by this job

Comprehensive health insurance
401(k) and parental leave
Performance bonuses

Job summary

MediaTek is seeking a technical leader with expertise in Packaging Architecture, specifically in 2.5D/3D/3.5D technologies. This role requires collaboration across various teams to develop innovative packaging solutions for automotive, datacenter/HPC, and computing applications. Ideal candidates will demonstrate strategic thinking and strong ownership skills.

The position involves identifying optimal package architectures and performing trade-off analyses while engaging with internal and external partners. Extensive hands-on experience in advanced semiconductor packaging is essential.

Salary range: $171,000 - $272,000, plus benefits.

Qualifications

  • 8+ years of experience in advanced packaging architecture, including key technologies.
  • Proven track record of successful package/product introduction.
  • Experience with high-speed interfaces, power-signal integrity, and thermal considerations.

Responsibilities

  • Identify optimal package architecture balancing electrical, thermal, and mechanical performance.
  • Work with partners on advanced packaging strategies.
  • Monitor competitive landscape in packaging technologies.

Skills

Advanced semiconductor package architecture expertise (2.5D/3D/3.5D)
Characterization and design of 2D, 2.5D, & 3D packaging solutions
High-speed interfaces (SERDES, PCIe)
Communication skills

Tools

EDA & CAD tools

Job description

MediaTek is seeking a technical leader with expertise in Packaging Architecture, specifically in 2.5D/3D/3.5D technologies. This role requires collaboration across various teams to develop innovative packaging solutions for automotive, datacenter/HPC, and computing applications. Ideal candidates will demonstrate strategic thinking and strong ownership skills.

The position involves identifying optimal package architectures and performing trade-off analyses while engaging with internal and external partners. Extensive hands-on experience in advanced semiconductor packaging is essential.

Salary range: $171,000 - $272,000, plus benefits.

Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

Senior 2.5D/3D Packaging Architect for HPC & Auto
Senior 2.5D/3D Packaging Architect for HPC & Auto

MediaTek Research Lab Inc. • San Jose (CA)

On-site
USD 171,000 - 272,000
Comprehensive health insurance
401(k) plan
Paid holidays and leave
Memory Packaging Lead for 2.5D/3D Solutions
Memory Packaging Lead for 2.5D/3D Solutions

MediaTek • San Jose (CA)

On-site
USD 180,000 - 272,000
Comprehensive health insurance
401(k)
Parental leave
+1
Packaging Architect
Packaging Architect

MediaTek Research Lab Inc. • San Jose (CA)

On-site
USD 171,000 - 272,000
Comprehensive health insurance
401(k) plan
Paid holidays and leave
Memory Packaging Tech Lead – 2.5D/3D Solutions
Memory Packaging Tech Lead – 2.5D/3D Solutions

MediaTek Research Lab Inc. • San Jose (CA)

On-site
USD 180,000 - 301,000
Comprehensive health insurance
Life and disability insurance
401(k) plan
+1
Packaging Architect
Packaging Architect

MediaTek • San Jose (CA)

On-site
USD 171,000 - 272,000
Comprehensive health insurance
401(k) and parental leave
Performance bonuses
Director of Advanced 2.5D/3D Packaging & Partnerships
Director of Advanced 2.5D/3D Packaging & Partnerships

MediaTek Research Lab Inc. • San Jose (CA)

On-site
USD 200,000 - 323,000
Comprehensive health insurance
401(k)
Parental leave
Director of Advanced Packaging & Technical Partnerships
Director of Advanced Packaging & Technical Partnerships

MediaTek • San Jose (CA)

On-site
USD 200,000 - 323,000
Comprehensive health insurance
401(k) plan
Parental leave
+1
Packaging Manager/Director
Packaging Manager/Director

MediaTek Research Lab Inc. • San Jose (CA)

On-site
USD 200,000 - 323,000
Comprehensive health insurance
401(k)
Parental leave
Packaging Manager/Director
Packaging Manager/Director

MediaTek • San Jose (CA)

On-site
USD 200,000 - 323,000
Comprehensive health insurance
401(k) plan
Parental leave
+1
Senior Optical Packaging Engineer - 2.5D/3D ICs
Senior Optical Packaging Engineer - 2.5D/3D ICs

MediaTek Research Lab Inc. • San Jose (CA)

Hybrid
USD 188,000 - 356,000
Health insurance
401K plan
Performance bonus
+1