Lead Packaging Architect: 2.5D/3D & Chiplet Systems
MediaTek
An application made for this job — a tailored resume and cover letter that speak straight to the posting.
Benefits offered by this job
Job summary
MediaTek is seeking a technical leader with expertise in Packaging Architecture, specifically in 2.5D/3D/3.5D technologies. This role requires collaboration across various teams to develop innovative packaging solutions for automotive, datacenter/HPC, and computing applications. Ideal candidates will demonstrate strategic thinking and strong ownership skills.
The position involves identifying optimal package architectures and performing trade-off analyses while engaging with internal and external partners. Extensive hands-on experience in advanced semiconductor packaging is essential.
Salary range: $171,000 - $272,000, plus benefits.
Qualifications
- 8+ years of experience in advanced packaging architecture, including key technologies.
- Proven track record of successful package/product introduction.
- Experience with high-speed interfaces, power-signal integrity, and thermal considerations.
Responsibilities
- Identify optimal package architecture balancing electrical, thermal, and mechanical performance.
- Work with partners on advanced packaging strategies.
- Monitor competitive landscape in packaging technologies.
Skills
Tools
Job description
MediaTek is seeking a technical leader with expertise in Packaging Architecture, specifically in 2.5D/3D/3.5D technologies. This role requires collaboration across various teams to develop innovative packaging solutions for automotive, datacenter/HPC, and computing applications. Ideal candidates will demonstrate strategic thinking and strong ownership skills.
The position involves identifying optimal package architectures and performing trade-off analyses while engaging with internal and external partners. Extensive hands-on experience in advanced semiconductor packaging is essential.
Salary range: $171,000 - $272,000, plus benefits.
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